H.B. Fuller
H.B. Fuller Company is a global manufacturer of adhesives, sealants, and specialty chemical products, serving industries that range from electronics and transportation to renewable energy and industrial assembly. Through legacy brands such as EPOCAP, KALEX, Cyberbond, and the WS-8020RC potting system, H.B. Fuller supplies two-part epoxy, polyurethane, and cyanoacrylate formulations engineered for structural bonding, electronic component protection, and environmental sealing. Its potting and encapsulating compounds are widely used to protect sensitive electronic assemblies from moisture, vibration, and thermal stress, while its structural and instant adhesives support high-speed assembly across a wide range of substrates. With decades of formulation experience, H.B. Fuller continues to develop chemistries that balance cure speed, mechanical performance, and long-term reliability for demanding industrial applications.
As an authorized H.B. Fuller distributor, Krayden supplies the full range of EPOCAP, KALEX, WS-8020RC, MP, and Cyberbond adhesive and potting products in the kit sizes and package quantities production teams need. Our materials specialists help customers select the right formulation for cure speed, hardness, and environmental performance, and support consistent supply for both prototype and full-scale production runs.
Featured Brands
Core H.B. Fuller product lines for electronics potting, encapsulating, and structural bonding.
Markets Served by H.B. Fuller
Epoxy Potting & Encapsulating Compounds
H.B. Fuller's epoxy potting and encapsulating compounds are two-part systems designed to fully surround and protect electronic components, connectors, and circuit assemblies from moisture, dust, vibration, and thermal stress. The EPOCAP line covers general-purpose formulations through high-reliability and flame-retardant chemistries, while EPOCURE curing agents and the HARDMAN EPOWELD structural epoxy round out the family for bonding and finishing needs. KALEX polyurethane compounds offer a flexible alternative where impact resistance and elongation matter more than rigid protection. Together, these chemistries give assembly teams a range of hardness, cure speed, and environmental resistance options for potting sensitive electronics.
WS-8020RC Two-Part Potting Kits
WS-8020RC is a two-part epoxy potting compound available in bulk Class B packaging as well as pre-measured 2.5oz kits in a range of batch sizes. The kit format pairs resin and hardener in the correct ratio, reducing measuring error and material waste for smaller potting jobs and lab-scale production runs. Larger Class B bulk packaging supports higher-volume manufacturing lines that use metering and dispensing equipment. Across all package sizes, WS-8020RC cures to form a protective, moisture- and vibration-resistant seal around electronic components.
Structural & Instant Bonding Adhesives
Beyond potting and encapsulating, H.B. Fuller supplies structural and instant adhesives for general assembly and bonding needs. The MP series covers multi-purpose epoxy adhesives for structural bonding across a range of substrates, while Cyberbond cyanoacrylate adhesive provides fast-fixturing instant bonds for smaller assembly and repair tasks. These chemistries are commonly used alongside potting compounds on the same production line, supporting both component protection and structural assembly.
Talk to a H.B. Fuller Materials Specialist
Whether you need help selecting the right encapsulant hardness and cure profile, formulating a bonding solution for structural assembly, or replenishing WS-8020RC kits at scale, our materials specialists can help you specify, sample, and order the right H.B. Fuller product with confidence.
H.B. Fuller Quick Reference
