Solstice Advanced Materials & Specialty Chemicals

Solstice Advanced Materials

Phase Change Materials

Phase Change Materials (PCMs) are thermal interface materials that improve heat transfer between electronic components and cooling solutions. They remain solid at room temperature and soften during operation to fill microscopic air gaps. This creates a thin thermal interface that delivers reliable cooling for processors, AI hardware, data centers, automotive electronics, and other high-power applications.

Thermal Insulators

Thermal Insulators are materials that provide electrical insulation while controlling heat flow in electronic assemblies. They protect sensitive components from electrical shorts and help maintain reliable performance in applications where electrical isolation is required alongside effective thermal management.

Thermal Gap Pads

Thermal Gap Pads are soft, compressible thermal interface materials that fill air gaps between heat-generating components and heat sinks. They improve heat transfer, accommodate uneven surfaces, and provide reliable thermal management in electronics, automotive systems, telecommunications equipment, and industrial applications.

Thermal Putty Pads

Thermal Putty Pads are conformable thermal interface materials that fill large or irregular gaps between electronic components and cooling surfaces. They provide efficient heat transfer, adapt to complex geometries, and maintain reliable thermal performance in high-density electronic assemblies.

Two Part Hybrid

Two-Part Hybrid Gap Fillers are dispensable thermal interface materials that cure into a soft, durable interface for efficient heat transfer. They fill large gaps, conform to uneven surfaces, and provide long-term thermal performance in high-power electronic applications.

One Part Hybrid

One-Part Hybrid Gap Fillers are ready-to-use thermal interface materials that provide efficient heat transfer between electronic components and cooling surfaces. They dispense easily, fill complex gaps, and deliver reliable long-term thermal performance without the need for mixing.

Thermal Grease

Thermal Greases are non-curing thermal interface materials that improve heat transfer between electronic components and cooling surfaces. They fill microscopic air gaps to reduce thermal resistance and provide consistent cooling in high-performance electronic applications.

 

Progressive Stamping

Progressive Stamping is a high-volume manufacturing process that produces precision metal parts with tight tolerances and consistent quality. It is widely used to manufacture heat spreaders for semiconductor and electronic applications.

Transfer Die Stamping

Transfer Die Stamping is a precision manufacturing process that produces complex metal parts with high accuracy and consistent quality. It is commonly used to manufacture heat spreaders for semiconductor and electronic applications.

Application Spotlight

Data Center Server Racks

Data Center Server Racks require efficient thermal management to keep high-performance processors, GPUs, memory modules, and power electronics operating within safe temperatures. As AI workloads and computing densities continue to increase, advanced thermal interface materials play a critical role in transferring heat from heat-generating components to heat sinks, cold plates, and liquid cooling systems. Solutions such as phase change materials, gap fillers, thermal greases, and heat spreaders help improve cooling efficiency, reduce hot spots, and ensure the long-term reliability of servers, networking equipment, and data center infrastructure.

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