Henkel - WikipediaHenkel

Henkel is a German multinational founded in 1876 and headquartered in Düsseldorf, employing about 50,000 people across more than 120 countries. The company operates through two business units, Adhesive Technologies and Consumer Brands, with Adhesive Technologies serving as the global market leader in adhesives, sealants, and functional coatings for industrial and consumer applications. Its industrial portfolio, sold under brands like Loctite, Bonderite, Technomelt, and Teroson, supports manufacturing and maintenance across industries from automotive and aerospace to electronics and packaging. Henkel reported sales of approximately 20.5 billion euros in fiscal year 2025, with Adhesive Technologies contributing roughly half of that total.

Krayden is an authorized distributor of Henkel's industrial adhesives, sealants, and specialty chemical brands, including Loctite, Bonderite, Frekote, Stycast, and Eccobond. As a Henkel-authorized partner, Krayden supplies genuine, traceable Henkel product and provides technical guidance on material selection, dispensing, and application for customers across electronics assembly, aerospace, and industrial manufacturing.

Featured Brands

Five Henkel brands covering adhesives, surface treatments, mold release, and electronics protection materials.

 

Eccobond™

Henkel's line of epoxy based encapsulants and underfills formulated to protect and reinforce electronic assemblies, spanning capillary flow underfills, glob top encapsulants, low pressure molding compounds, and UV curable optically clear materials.

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Bonderite™

Henkel's brand for metal pretreatment and surface technology, covering industrial cleaners, conversion coatings, and chemical milling and maskant products for aluminum, steel, and other substrates.

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LOCTITE ECCOBOND 50400-1 Buy - Henkel Adhesive Technologies from abovo AG
Loctite™

Henkel's flagship brand of adhesives, sealants, and surface treatment chemistries, spanning anaerobic threadlockers, cyanoacrylates, epoxies, silicones, and UV cure formulations across industrial, aerospace, and electronics applications.

View Loctite Brand Page
 

Frekote™

Henkel's line of mold release agents, sealers, and cleaners for composite and rubber molding operations, reducing part defects and mold fouling across aerospace, marine, and consumer goods manufacturing.

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Stycast™

Henkel's line of two part epoxy and silicone potting and encapsulation compounds, formulated for long pot life and ease of handling, protecting sensitive circuitry and electronic assemblies.

View Stycast Brand Page
 

Markets Served by Henkel

Aerospace Automotive Automotive Aftermarket Building & Construction Components Consumer Electronics Data & Telecommunications Furniture & Interiors Industrial Maintenance & Repair Industrial Manufacturing Medical Metals Packaging & Converting Personal Hygiene Power Semiconductor Sports & Fashion
Henkel Structural & Sealing Solutions

Adhesives & Sealants

Henkel's Adhesives & Sealants portfolio spans general purpose and structural adhesives alongside gasketing sealants formulated to replace or supplement mechanical gaskets. These products are engineered for a wide range of substrates and service conditions, from everyday assembly work to demanding industrial and transportation environments. Formulated across epoxy, silicone, acrylic, and anaerobic chemistries, the range gives manufacturers a bonding or sealing solution suited to their specific temperature, chemical exposure, and cure speed requirements.

LOCTITE® EA E-40FL - Henkel Adhesives
Adhesives

Adhesives

General purpose and structural adhesive formulations used to bond metal, plastic, composite, and other substrates across industrial and consumer applications.

LOCTITE® SI 5900 - Henkel Adhesives
Gasketing

Gasketing Sealants (CIPG & FIPG)

Cured in place (CIPG) and formed in place (FIPG) sealants dispensed directly onto flanges and housings, curing into a flexible gasket that seals against fluid leakage and vibration.

 
Henkel Semiconductor Assembly Materials

Die Attach Materials

Die Attach Materials are formulated to mechanically and thermally bond semiconductor die to substrates, leadframes, or packages during electronics assembly. Henkel's die attach portfolio includes film, paste, and sintering chemistries selected based on electrical conductivity requirements, thermal performance, and processing method. These materials are critical to package reliability, since a properly attached die manages heat dissipation and mechanical stress throughout the device's operating life. The category also includes wafer backside coatings applied prior to dicing to prepare die for later attachment steps.

LOCTITE ABLESTIK ECF 561E - Electronics - Henkel Adhesives
Films

Die Attach Films

Pre-cut or roll form adhesive films used to bond die to a substrate, offering uniform bond line thickness and clean, void free application in high volume assembly.

LOCTITE® ABLESTIK 84-1LMISR4 - Henkel Adhesives
Pastes

Die Attach Pastes

Dispensable adhesive pastes, often silver filled for electrical or thermal conductivity, used to attach semiconductor die during package assembly.

Loctite Ablestik NCA 2286 | Dual cure adhesive for active alignment of  camera modules | NCA2286
Sintering

Sintering and Semi Sintering Pastes

Silver sinter die attach materials that form a metallurgical bond under heat and pressure, offering higher thermal conductivity and reliability than traditional epoxy die attach for power and high temperature devices.

LOCTITE DAG 1050
Coatings

Wafer Backside Coatings

Conductive or adhesive coatings applied to the back surface of a wafer prior to dicing, preparing individual die for later die attach processing.

 
Henkel Electronics Assembly Materials

Electronics Assembly Adhesives & Inks

Electronics Assembly Adhesives & Inks cover the film and paste adhesives used to attach components, shield against electromagnetic interference, and provide structural bonding during PCB and device assembly. Depending on the application, these materials are formulated to conduct electricity or to electrically insulate while still delivering mechanical bond strength.

LOCTITE ABLESTIK 5020 | 5020
Film Adhesives

Assembly Film Adhesives

Sheet form adhesives used in electronics and component assembly where uniform bond line thickness and clean handling are required.

Loctite Ablestik EMI 3620FA | Compartment EMI shielding. Jet dispensed  conductive filler | EMI3620FA
Conductive

Electrically Conductive Adhesives

Silver filled adhesives used for grounding, EMI shielding, and electrical interconnection where conductivity is required without a solder joint.

LOCTITE ABLESTIK NCF 218 | Film Underfill for 3d die stacking in memory  devices | NCF218
Non-Conductive

Non Conductive Adhesives

Electrically insulating adhesives used for die attach and general assembly where mechanical bonding is needed without electrical conductivity.

 
Henkel Electronics Protection Materials

Encapsulants & Underfills

Encapsulants & Underfills protect electronic components and interconnects from moisture, mechanical shock, and thermal cycling. Underfills are dispensed beneath flip chip and BGA packages to reinforce solder joints, while potting and glob top materials fully encapsulate components or assemblies for environmental protection. Optically clear formulations extend this protection to applications like displays and optical sensors where light transmission must be preserved.

LOCTITE® STYCAST 2850 FT BLK - Henkel Adhesives
Potting

Potting Materials

Liquid resins used to fully encapsulate an assembly or housing, protecting it from moisture, vibration, and thermal extremes.

LOCTITE® ECCOBOND FP4450 - Henkel Adhesives
Liquid Encapsulants

Liquid Encapsulants

Dispensable epoxy compounds, including glob top formulations, used to cover and protect die and wire bonds on a circuit board.

LOCTITE ECCOBOND LCM 1000AG-1 | Wafer level encapsulant for CoW, 2.5D |  LCM1000AG-1
Low Pressure Molding

Low Pressure Molding

Thermoplastic or thermoset molding compounds processed at low pressure to encapsulate delicate components without damaging sensitive circuitry.

Loctite Eccobond UF 1173 | SVHC Free Board level underfill with low CTE |  UF1173
Underfills

Underfills

Capillary flow epoxy materials dispensed beneath flip chip and BGA packages to reinforce solder joints and distribute thermal and mechanical stress.

Loctite Eccobond UV8800M | UV cure smartcard encapsulant for CSP and BGA  packages | UV8800M
Optically Clear

Optically Clear Materials

UV curable or optically transparent encapsulants used where light transmission must be preserved, such as displays, sensors, and optoelectronic packages.

 
Henkel Thermal Management Solutions

Thermal Interface Materials

Thermal Interface Materials manage heat transfer between electronic components and heat sinks or enclosures, improving reliability and performance in power electronics, LED, and telecom applications. Henkel's portfolio spans gap filling pads, dispensable one part and two part gap fillers, and thermal greases, selected based on the required thermal conductivity, gap thickness, and assembly process.

BERGQUIST® SIL PAD® TSP Q2500 - Henkel Adhesives
Gap Pads

Thermal Gap Pads

Soft, compressible pads that fill the air gap between a heat generating component and a heat sink, improving thermal conductivity while accommodating tolerance stack up.

BERGQUIST® LIQUI BOND TLB EA1800 - Henkel Adhesives
Two Part Hybrid

Two Part Hybrid

Dispensable two component gap filler and thermal bonding materials that cure in place, combining thermal conductivity with adhesive bond strength.

BERGQUIST® LIQUI FORM TLF LF3500 | Henkel Adhesives
One Part Hybrid

One Part Hybrid

Single component, dispensable gap filler materials that simplify processing while still delivering strong thermal performance.

BERGQUIST® GAP FILLER TGF 4000 | Henkel Adhesives
Thermal Grease

Thermal Grease

Non curing thermal compounds applied between a component and heat sink to fill microscopic surface irregularities and maximize heat transfer.

 
Henkel Specialty & Mold Support Materials

Specialty Chemicals, Molding Compounds & Mold Maintenance

This group brings together specialty materials that support semiconductor packaging and mold maintenance processes, from epoxy molding compounds and catalysts to the mold release agents, cleaning compounds, and adhesion promoters that keep production tooling running cleanly.

LOCTITE ABLESTIK 285 CAT 11 – Electronics - Henkel Adhesives
Additives

Additives

Catalysts and hardeners that activate or accelerate cure in two part adhesive and epoxy systems.

Loctite GC 10 | SAC305 T3, T4, T5 powders | GC10
Mold Compounds

Semiconductor Epoxy Mold Compounds

Powdered or granular epoxy resins used in transfer molding to encapsulate semiconductor die and protect them within a finished package.

LOCTITE ECCOBOND LUX OGR150THTG – Electronics - Henkel Adhesives
Optoelectronic

Optoelectronic Epoxy Mold Compounds

Epoxy molding compounds formulated for optical clarity and stability, used to encapsulate LEDs and other optoelectronic components.

Loctite MSC-01|Solder paste Cleaner | MSC-01
Cleaning

Melamine Cleaning Compounds

Abrasive melamine based cleaning materials used to remove mold release residue and cured resin buildup from molds between production runs.

Frekote 700-nc Mold Release Agent Clear 10.5oz Aerosol Spray Can - Krayden  Corp
Mold Release

Mold Release Sprays

Sprayable release agents applied to mold surfaces to prevent parts from sticking during composite and rubber molding operations.

BONDERITE® M-CR 1132 AERO - Henkel Adhesives
Primers

Adhesion Primers & Promoters

Conversion coatings and primers applied to a substrate before bonding or painting, improving adhesion and corrosion resistance on aluminum, steel, and other metal surfaces.

 

Talk to a Henkel Materials Specialist

Whether you need material selection support, dispensing and process guidance, production volume pricing, or help navigating the full Henkel portfolio, our technical team is ready to help. As an authorized Henkel distributor, we provide direct access to Loctite, Bonderite, Frekote, Stycast, and Eccobond with local support and fast-turn delivery.

Henkel Quick Reference

Brands Carried
Loctite, Bonderite, Frekote, Stycast, Eccobond
Core Technology
Epoxy, Silicone, Acrylic & Anaerobic Chemistries
Top Categories
Adhesives & Sealants, Die Attach, Encapsulants & Underfills, Thermal Materials
Key Markets
Electronics, Aerospace, Automotive, Industrial Manufacturing

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