Electronic components must be shielded from high temperatures, chemicals, and moisture, but conventional injection mold bonding and encapsulation production processes are time-consuming and have design constraints. Low-Pressure Molding (LPM) is a manufacturing process ideal for encapsulating and protecting delicate electronic components, including printed circuit boards [PCBs], automotive components, mobile phone batteries, wiring harnesses, connectors, switches, sensors, control units, antennas, cables and many other crucial components. Unlike traditional injection molding or potting, LPM utilizes significantly lower pressure and heat, making it perfect for sensitive electronics that wouldn't withstand harsher environments.
LPM typically uses thermoplastic materials with low viscosity, allowing for over-molding and encapsulation of even the most sensitive PCB assembly. Since the ingredients are natural adhesives, the procedure works well for sealing circuitry against moisture, dust, and grime, often up to an IP-68 classification.
