LOCTITE ABLESTIK 2025DNP
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Excellent dispense capabilities
- For mother die in array packaging
- 260ºC reflow capability for Pb-free applications
Product Description
LOCTITE® ABLESTIK ABP 2025DNP is a proprietary hybrid chemistry-based, red-colored, non-conductive die attach adhesive formulated for use in advanced semiconductor array packaging, including PBGA, Flex BGA, and stacking BGA configurations. As a PFAS-free alternative to ABLESTIK 2025D and QMI536NB, it delivers robust adhesion, excellent thermal stability, and reliable performance under high-temperature, high-humidity, and Pb-free reflow environments.
This heat-curable adhesive exhibits minimum bleed, strong hot/wet die shear strength, and superior electrical insulation, making it ideal for sensitive, high-reliability electronics.
Recommended cure schedule
- 30 minutes ramp to 175°C + 15 minutes @ 175°C in N2
2025DNP
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS LOCTITE ABLESTIK ABP 2025DNP issue 09-24
- LOCTITE ABLESTIK ABP 2025DNP 10CC SY NL-MSDS_UT_NL
- LOCTITE ABLESTIK ABP 2025DNP 10CC SY NL-MSDS_UT_EN
