LOCTITE ABLESTIK 2033SC
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Low cure temperature
- Legacy smartcard product
- Optimized rheology
Product Description
LOCTITE ABLESTIK 2033SC die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries. This monocomponent low bleed product has long work life and can cure fast at low temperatures, making it ideal for smart-card applications.
Cure Schedule
- 90 seconds @ 110°C
LOCTITE ABLESTIK 2033SC is a mature and price efficient product. Legacy smartcard products could and should be served by 2033SC. For new applications and snap cure materials though we suggest you take a look at LOCTITE ABLESTIK 2035SC and LOCTITE ABLESTIK 2035SCR.
Product Key Features
- Engineered to cure quickly at lower temperatures, which minimizes thermal stress on sensitive semiconductor components and accelerates production cycle times.
- Optimized for automated assembly processes, making it ideal for high-speed, high-volume production lines.
- Provides superior adhesion and stability under both thermal and mechanical stress, ensuring long-term reliability of the bonded device.
- Exhibits low bleed characteristics
Applications
- Smart Card Bonding: Specifically designed for bonding Si dies to PBGA-FR4.
- Microelectronics assembly
- High-volume die attach
2033SC
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 55 daysPackaging
TDS, SDS & Technical Documents
- LOCTITE ABLESTIK 2033SC
- LOCTITE ABLESTIK 2033SC EN
- LOCTITE ABLESTIK 2033SC known as Ablebond 2033SC (
