LOCTITE ABLESTIK 2600K
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Very Thermally conductive (20 W/mK)
- Good dispensability
- Low moisture absorption
Product Description
LOCTITE® ABLESTIK 2600K adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension system containing silver, thermoplastic and thermoset resin particles suspended in a solvent carrier. Once the material is fully cured and the solvent is evaporated, the adhesive has an extremely high silver loading.
LOCTITE ABLESTIK 2600K adhesive provides very low thermal resistance between chip to case, nearing solder and eutectic-type materials. This low stress adhesive has excellent delamination properties and yields consistent dot sizes with minimal or no tailing. Typically used for high power devices and heat sink attach.
Cure Schedule
- 30 minute ramp from 100°C to 200°C + 15 minutes @ 200°C
- 30 minute ramp from 25°C to 175°C + 1 hour @ 175°C
2600K
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TDS, SDS & Technical Documents
- 1201343_MSDS_UT_US_EN
- TDS LOCTITE ABLESTIK 2600K issue 08-14
