LOCTITE 3515
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Cornerbond
- Fast cure
- Self alignment of SMT components
Product Description
LOCTITE 3515 is a one component epoxy adhesive, designed to allow self-alignment of SMT components during the reflow operation. The adhesive is pre-applied to the board at the corners of the CSP pad site using a standard SMA dispenser, a process that speeds assembly by eliminating post-reflow underfill dispense and cure steps.
LOCTITE 3515 cures during the solder reflow phase to form a reliable bond, and contributes to improvements in handheld device reliability. LOCTITE 3515 cornerbond has excellent dispensing characteristics, good dot profile, and good on-board electrical characteristics. Reinforcement of CSPs with interposers or comerless arrays in portable electronic devices.
Cure Schedule
- 30 minutes @ 150 °C
- 5 minutes @ 180 °C
- 30 seconds @ 200 °C
- 15 seconds @ 220 °C
3515
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TDS, SDS & Technical Documents
- 3515-EN
- 540459_MSDS_UT_US_EN
