LOCTITE 3619
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- SMD components on PCB
- Chipbonder
- Very High dispense speed
Product Description
LOCTITE 3619 is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures arerequired with heat sensitive components, and in applications where short curing times are required.
LOCTITE 3619 is a red, high viscosity, epoxy paste with high wet strength. It claims 25,000 - 40,000 dots per hour dispensing speed and is typically used for mountin SMD components onto a PCB.
Cure schedule
- 30 minutes @ 100°C
Note: Sufficient time must be added to allow the bond location to reach the desired cure temperature. Curing profiles should be developed for each device. Bond strength achieved in practice will vary considerably depending on the SMD component type, adhesive dot size and the type, grade and degree of cure of the solder mask/resist.
3619
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
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TDS, SDS & Technical Documents
- 3619-EN
- 1099559_MSDS_UT_US_EN
- MSDS LOCTITE 3619 issue 03-23 (FR)
- MSDS LOCTITE 3619 issue 03-23 (EN)
