LOCTITE ABLESTIK 789-3

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

LOCTITE ABLESTIK 789-3

Main features

  • Non conductive
  • Good moisture resistance
  • Substrate attach

Product Description

LOCTITE ABLESTIK 789-3 die attach adhesive is designed for microelectronic applications. This adhesive exhibits strong adhesion to difficult-to-bond metals and retains its bond strength after exposure to moisture.

LOCTITE ABLESTIK 789-3 is a non conductive epoxy adhesive with good moisture resistance and high bond strength. It is typically used for substrate attach and package sealing on gold, silver and copper substrates.

Cure Schedule

  • 30 minutes @ 150°C 
  • 4 hours @ 93°C
Product Family

789-3

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TDS, SDS & Technical Documents
  • ABLESTIK 789-3-EN
    English (Technical Data Sheet (TDS))
  • LOCTITE ABLESTIK 789-3 known as Ablebond 789-3 (12g), NL-MSDS_UT_NL
    Dutch (Safety Data Sheet (SDS))
  • LOCTITE ABLESTIK 789-3 known as Ablebond 789-3 (12g), EN-MSDS_UT_EN
    English (Safety Data Sheet (SDS))

Technical Specifications

General Properties
Work life @25°C Work life @25°C
2184 hours
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
126 °C
Thermal Conductivity Thermal Conductivity
0.3 W/m.K
Weight Loss @ 300°C Weight Loss @ 300°C
0.28 %
Electrical Properties
Volume Resistivity Volume Resistivity
2000000000000000 Ohms⋅cm
Physical Properties
Viscosity Viscosity
36,500 mPa.s

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