LOCTITE ABLESTIK 789-3
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

Main features
- Non conductive
- Good moisture resistance
- Substrate attach
Product Description
LOCTITE ABLESTIK 789-3 die attach adhesive is designed for microelectronic applications. This adhesive exhibits strong adhesion to difficult-to-bond metals and retains its bond strength after exposure to moisture.
LOCTITE ABLESTIK 789-3 is a non conductive epoxy adhesive with good moisture resistance and high bond strength. It is typically used for substrate attach and package sealing on gold, silver and copper substrates.
Cure Schedule
- 30 minutes @ 150°C
- 4 hours @ 93°C
Packaging
TDS, SDS & Technical Documents
- ABLESTIK 789-3-EN
- LOCTITE ABLESTIK 789-3 known as Ablebond 789-3 (12g), NL-MSDS_UT_NL
- LOCTITE ABLESTIK 789-3 known as Ablebond 789-3 (12g), EN-MSDS_UT_EN