LOCTITE ABLESTIK 8008
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Snap curable after B stage
- Low modulus
- Void free bondline without bleed
Product Description
LOCTITE® ABLESTIK 8008 snap curable adhesive is designed for small die sizes (an be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed.
LOCTITE ABLESTIK 8008 should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes.
Packaging
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TDS, SDS & Technical Documents
- LOCTITE ABLESTIK 8008
Technical Specifications
General Properties
Work life @25°C Work life @25°C
24 hours Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
270 °C Thermal Conductivity Thermal Conductivity
2.2 W/m.K Physical Properties
Thixotropic index Thixotropic index
2.6 Viscosity Viscosity
48,000 mPa.s 
