LOCTITE ABLESTIK 84-1LMI
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Low bleed
- Low outgassing
- Electrically conductive
Product Description
LOCTITE ABLESTIK 84-1LMI epoxy die attach adhesive is designed for microelectronic chip bonding applications. This rigid adhesive is ideal for application by automatic dispenser or hand probe. It can be used on Noble metals and offers excellent mechanical and chemical strength. This product, just as its close relative 84-1LMISR4 are designed for stencil printing.
LOCTITE ABLESTIK 84-1LMI is a highly electrically conductive, silver filled adhesive with low bleed and low outgassing that meets the requirements of MIL-STD883, Method 5011. This product long work life and high reliability across industries and is typically used for component and die attach for the military, automotive, industrial and semiconductor sector. Its operating temperature is -40 up to 150°C.
Cure Schedule
- 1 hour @ 150°C
- 2 hours @ 125°C
84-1LMI
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TDS, SDS & Technical Documents
- LOCTITE ABLESTIK 84-1LMI
- LOCTITE ABLESTIK 84-1LMI known as Ablebond 84-1LMI (10.8g), NL-MSDS_UT_NL
- LOCTITE ABLESTIK 84-1LMI known as Ablebond 84-1LMI (10.8g), NL-MSDS_UT_EN
- CAPLINQ Die Attach Paste Handling Guide
