LOCTITE ABLESTIK 84-1LMISNB
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Long work life
- High purity
- Electrically conductive
Product Description
LOCTITE ABLESTIK 84-1LMISNB electrically conductive adhesive is designed for semiconductor packaging applications. This halogen free, heat curable adhesive is filled with silver and has high purity. Its poisson's ration, as with the majority of adhesives is 0.33.
LOCTITE ABLESTIK 84-1LMISNB meets the requirements of MIL-STD-883, Method 5011.
Cure Schedule
- 1 hour @ 175°C
- 30 minutes @ 200°C
84-1LMISNB
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 30 days
Shipping in 12 weeks
Shipping in 55 daysPackaging
TDS, SDS & Technical Documents
- LOCTITE ABLESTIK 84-1LMISNB
- LOCTITE ABLESTIK 84-1LMISNB RoHS declaration 12-20
- LOCTITE ABLESTIK 84-1LMISNB RoHS report SGS 03-20
- LOCTITE ABLESTIK 84-1LMISNB Halogen report SGS 03-20
- LOCTITE ABLESTIK 84-1LMISNB known as Ablebond 84-1LMISNB (17g), NL-MSDS_UT_NL
- LOCTITE ABLESTIK 84-1LMISNB known as Ablebond 84-1LMISNB (17g), EL-MSDS_UT_EL
- CAPLINQ Die Attach Paste Handling Guide
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Additional Information
What is the Density of 84-1LMI?
Density is typically stated for the wet state of the material. Cured density for die attach materials will be a few % higher but this is not a value that we measure. Generally, uncured (wet state) density is important for calculating usage while cured density is important for running modelling based on thermo-mechanical properties.
84-1LMI series are all “solvent free” so the weight loss on cure is small, and therefore the change in density during cure is also small.
Can I mix two die attach syringes together?
Customers should never remix the materials as it will change properties like TI. Please note that if you remix without our approval then we are no longer responsible for the material's end quality.
If you want to centrifuge them for void removal then, of course, this is a standard procedure for individual syringes. In this case 1 to 2 minutes at 1000rpm is sufficient on a planetary mixer. But mixing two syringes together is not advised or supported. Please contact us to see how we can resolve your issues without having to do this workaround.
