LOCTITE ABLESTIK 84-1LMISR4
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Excellent dispense capabilities
- Stencil printable
- Bare Copper Substrate
Product Description
LOCTITE ABLESTIK 84-1LMISR4 electrically conductive, halogen free, die attach adhesive has been formulated for use in high throughput, automated die attach equipment. The rheology of ABLESTIK 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems.
LOCTITE ABLESTIK 84-1LMISR4 is a manufacturer's product of choice, can be used for LED applications and like most epoxies it is suitable for bare Copper substrates and small die sizes. Interested in higher conductivity? Then you might want to consider 8060T or even 8064T for larger dies.
LOCTITE ABLESTIK 84-1LMISR4 can be applied by stamping, stencil or dispensing and it should present sufficient stiffness to allow wire bonding. Its unique combination of adhesive properties makes this material one of the most widely used die attach materials in the semiconductor industry.
Cure Schedule
- 1 hour @ 175°C
84-1LMISR4
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 15 days
Shipping in 12 weeks
Shipping in 40 daysPackaging
TDS, SDS & Technical Documents
- LOCTITE ABLESTIK 84-1LMISR4
- LOCTITE ABLESTIK 84-1LMISR4 Halogen Free
- LOCTITE ABLESTIK 84-1LMISR4 known as 84-1 LMISR4 5cc EFD LL 18 G NL-MSDS_UT_NL
- LOCTITE ABLESTIK 84-1LMISR4 known as 84-1 LMISR4 5cc EFD LL 18 G NL-MSDS_UT_EN
- CAPLINQ Die Attach Paste Handling Guide
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Physical Properties
Additional Information
DMA Curve of 84-1LMISR4
Can I cure 84-1LMISR4 at 120°C?
We have been discussing the possibility to cure 84-1LMISR4 at 120 °C with multiple Henkel applications engineers and we do not recommend this approach as it is very risky. The official Henkel recommendation is a minimum cure temperature of 125 °C.
We fear that a combination of an SR4 batch with relatively low reactivity (but within spec), and a cool spot in the curing oven might occasionally fail to “kick-off” the curing reaction.
The syringe size limits me due to the pot life. What can I do?
If you are worried about waste because the equipment can only use X grams of glue in an 8-hour shift, then it may be possible to buy some empty syringes/piston kits from Nordsen/EFD and transfer part of the adhesive from the larger syringe into an empty syringe. It requires a “tip-to-tip” adaptor (which can be washed & re-used), an airline with a regulator, and takes only a couple of minutes. This way you can "ration" the product without too much waste.
