LOCTITE ABLESTIK 84-1LMIT
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Electrically conductive
- High thermal conductivity
- MIL 5011 - NASA
Product Description
LOCTITE ABLESTIK 84-1LMIT epoxy adhesive is designed for medium die attach applications. This adhesive is ideal for application by syringe dispensing or screen printing. The T in the product name stands for Thermal since it has 2 times higher thermal conductivity (± 4W/mK) than the standard LMI version.
LOCTITE ABLESTIK 84-1LMIT meets the military requirements of MIL-STD883C, Method 5011 and also passes NASA outgassing requirements. It is an electrically and thermally conductive, solvent free adhesive with high purity and low outgassing.
Cure Schedule
- 1 hour @ 150°C
84-1LMIT
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- ABLESTIK 84-1LMIT-EN
- LOCTITE ABLESTIK 84-1LMIT known as Ablebond 84-1LM SDS EN
- LOCTITE ABLESTIK 84-1LMIT known as Ablebond 84-1LM SDS
