LOCTITE ABLESTIK 84-1LMIT1
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Electrically conductive
- High thermal conductivity
- Faster Screen printing
Product Description
LOCTITE ABLESTIK 84-1LMIT1 epoxy adhesive is designed for medium sized die attach applications. It is designed for screen printing using 325 mesh. This T1 version has lower viscosity, for finer and faster screen printing compared to 84-1LMIT.
LOCTITE ABLESTIK 84-1LMIT1 meets the military requirements of MIL-STD883C, Method 5011 and also passes NASA outgassing requirements. It is an electrically and thermally conductive, solvent free adhesive with low viscosity and good adhesion.
Cure Schedule
- 1 hour @ 150°C
- 2 hours @ 125°C
84-1LMIT1
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 28 days
Shipping in 12 weeks
Shipping in 50 daysPackaging
TDS, SDS & Technical Documents
- TDS LOCTITE ABLESTIK 84-1LMIT1 issue 08-19
- MSDS LOCTITE ABLESTIK 84-1LMIT1 issue 11-17 (EN)
- MSDS LOCTITE ABLESTIK 84-1LMIT1 issue 11-17 (FR)
- CAPLINQ Die Attach Paste Handling Guide
