LOCTITE ABLESTIK 933-1
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Improved work life
- Electrically insulating
- Low CTE
Product Description
LOCTITE ABLESTIK 933-1 black epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests.
LOCTITE ABLESTIK 933-1 is an electrically insulating encapsulant that exhibits a longer work life and a lower moisture sensitivity than the anhydride-cured system.
Cure Schedule
- 2 hours @ 125°C
933-1
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TDS, SDS & Technical Documents
- ABLESTIK 933-1-EN
- 1188896_MSDS_UT_US_EN
Technical Specifications
General Properties
Density (g) Density (g)
2 g/cm3 Specific Gravity Specific Gravity
2.1 Work life @25°C Work life @25°C
1464 hours Chemical Properties
Water Absorption Water Absorption
0.11 % Physical Properties
Viscosity Viscosity
360,500 mPa.s Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
124 °C Thermal Conductivity Thermal Conductivity
1 W/m.K Weight Loss @ 300°C Weight Loss @ 300°C
0.67 % 
