LOCTITE ABLESTIK 958-11
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Non conductive
- Absorbs stress
- Bonding of large ICs
Product Description
LOCTITE ABLESTIK 958-11 epoxy adhesive is designed to absorb stresses produced when bonding large ICs. It is a non conductive, white die attach that cures with heat and has a pH of ~4 to 9.
Cure Schedule
- 2 hours @ 130°C
- 1 hour @ 150°C
958-11
1. Select Package Type
Catalog Product
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Product availability 
Shipping in 25 days
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 25 days Shipping in 12 weeks Shipping in 12 weeksPackaging
Please select Package Type before adding your product to your cart.
TDS, SDS & Technical Documents
- ABLESTIK 958-11-EN
- 1200000_MSDS_UT_US_EN
Technical Specifications
General Properties
Work life @25°C Work life @25°C
336 hours Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
89 °C Electrical Properties
Volume Resistivity Volume Resistivity
500000000000000 Ohms⋅cm Physical Properties
Viscosity Viscosity
45,000 mPa.s 
