LOCTITE ABLESTIK 965-1L
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Main features
- Stress absorbing
- Low contaminants
- For large dies
Product Description
LOCTITE ABLESTIK 965-1L is designed for bonding large die integrated circuits with mismatched coefficients of thermal expansion. It is designed for high speed, automated assembly operations.
LOCTITE ABLESTIK 965-1L is a silver filled epoxy that absorbs stress while also claims low levels of contaminants. It offers a void free bond line with minimal bleed.
Cure Schedule
- 1 hour @ 150°C
Packaging
TDS, SDS & Technical Documents
- ABLESTIK 965-1L-EN
- 1199698_MSDS_UT_US_EN