ABchimie R3231 1-Part Neutral Cure Sealant
Harmonization Code : 3214.10.00 | Putty and other mastics | Resin cements, caulking compounds and other mastics
Main features
- Meets MIL-A-46146B requirements
- UL94 V-1 compliant
- Non-corrosive, neutral alkoxy cure
Product Description
ABChimie R3231 is a high-performance 1-part, non-corrosive, neutral-cure silicone engineered for adhesion, sealing, shallow potting, and coating in electronic assemblies. Designed to meet the stringent physical, chemical, and temperature-resistance requirements of MIL-A-46146B, R3231 is formulated for mission-critical applications demanding long-term durability and material compatibility.
Product Key Features
✔ Meets MIL-A-46146B requirements
✔ UL94 V-1 compliant
✔ Non-corrosive, neutral alkoxy cure
✔ Self-leveling liquid for coating and shallow potting
✔ Excellent adhesion to metals, plastics, and PCB substrates
✔ Contains UV tracer for inspection under 365 nm blue/UV light
✔ Wide service temperature range: –62°C to +200°C
✔ High elongation and flexibility (400%)
✔ Outstanding electrical insulation properties
Applications
- Shallow potting of electronic assemblies
- Conformal coating for circuit protection
- Bonding and sealing of components and housings
- Stress-relieving encapsulation of delicate circuitry
- Moisture and chemical protection for sensors, modules, and connectors
- Applications requiring MIL-grade durability and UL94 V-1 safety performance
ABCHIMIE R3231
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 8 weeksPackaging
TDS, SDS & Technical Documents
- R3231 TDS
- R3231 SDS
Technical Specifications
Physical Properties
General Properties
Mechanical Properties
Thermal Properties
Electrical Properties
Additional Information
ABchimie R3231: Self-Leveling Neutral Alkoxy Silicone
ABChimie R3231 is engineered for manufacturers requiring high-reliability silicone protection for electronic assemblies. Its neutral alkoxy cure system combines excellent substrate compatibility with robust mechanical and dielectric performance, making it extremely versatile for bonding, sealing, coating, or shallow potting in automotive, aerospace, and industrial sectors.
Application Methods
1. Manual or Pneumatic Dispensing
Ideal for cartridges at 2.25–3.45 bar (40–50 psi). Avoid excessive pressure to prevent splatter.
2. Adhesive Bonding
Join components within the 18-minute tack-free window. A bond-line thickness of ≥ 1 mm is recommended for optimal elasticity.
3. Coating & Shallow Potting
The self-leveling formula flows easily around complex components. Note that cure time increases with potting depth.
Curing Conditions
Optimal at 20–30°C and 40–70% RH.
Tack-free: 18 mins | 3mm Cure: 72 hrs | Full Cure: 7 days.
Material Compatibility
✔ Metals: Copper, Brass, Steel, Al
✔ PCB Substrates (FR4)
✔ Sensitive Electronics (Non-corrosive)
✔ UL94 V-1 Fire Performance Requirements
Technical Advice
Cleaning: Use DRP10-2 solvent for equipment and uncured material.
Surface Prep: Surfaces must be clean and dry. Primers are typically not required for most substrates.
Frequently Asked Questions
What makes R3231 suitable for electronics?
It is non-corrosive and formulated to meet MIL-A-46146B, ensuring safety with sensitive metals and offering outstanding electrical insulation.
Can R3231 be used for potting?
Yes, it is ideal for shallow potting. For depths greater than 15mm, cure times increase and technical guidance is recommended.
Is R3231 safe for use with copper?
Yes. The alkoxy neutral-cure chemistry is non-corrosive and fully compatible with copper, brass, and other sensitive substrates.
What is the shelf life and storage?
12 months when stored below 40°C in original unopened containers.
Compliance You Can Trust ✅
Secure your electronic assemblies.
Contact our technical engineers for assistance with dispensing setups, volume pail requirements, or specific substrate testing.
