LOCTITE ABLESTIK ABP 2030SCR
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Low moisture uptake
- Low stress
- Solvent free
Product Description
LOCTITE® ABLESTIK ABP 2030SCR silver filled conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes. Another interesting property is that it exhibits lower strength at higher temperatures for easier chip removal.
LOCTITE® ABLESTIK ABP 2030SCR is a hybrid, snap cure, low stress product that is typically used for smart cart applications. It is the improved and latest version that supersedes 2030SC and 2030SCM.
Cure Schedule
- 120 seconds @ 120°C
- 10 seconds @ 150°C
ABP2030SCR
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 35 days
Shipping in 12 weeks
Shipping in 35 daysPackaging
TDS, SDS & Technical Documents
- LOCTITE ABLESTIK ABP 2030SCR
- MSDS 2024614 en_GB
- LOCTITE ABLESTIK ABP 2030SCR
