LOCTITE ABLESTIK ABP 2032S

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Loctite Ablestik ABP 2032S

Main features

  • Low temperature cure
  • Good adhesion
  • Electrically conductive

Product Description

LOCTITE ABLESTIK ABP 2032S electrically conductive epoxy adhesive is designed as a Pb-free alternative to solder. It cures quickly at low temperatures for good stress control in small to medium die applications. It is a tried and proven product for optical sensor ASIC attach and for Lid attach for optical sensors and 3d sensing modules.

LOCTITE ABLESTIK ABP 2032S has good adhesion and good dispensing characteristics, This material can cure in temperatures as low as 80°C and works great on substrates such as Gold, Steel and Silver. 

Cure Schedule

  • 60 minutes @ 80°C
  • 3 minutes @ 150°C or
  • 10 minutes @ 120°C
Product Family

ABP2032S

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Catalog Product

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Product availability
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Packaging
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TDS, SDS & Technical Documents
  • LOCTITE ABLESTIK ABP 2032S
    English (Technical Data Sheet (TDS))
  • LOCTITE ABLESTIK ABP2032S
    English (Safety Data Sheet (SDS))
  • LOCTITE ABLESTIK ABP 2032S known as ABP 2032S (17g
    Dutch (Safety Data Sheet (SDS))

Technical Specifications

General Properties
Work life @25°C Work life @25°C
24 hours
Thermal Properties
Thermal Conductivity Thermal Conductivity
1 W/m.K
Physical Properties
Thixotropic index Thixotropic index
4.5
Viscosity Viscosity
11,000 mPa.s

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