LOCTITE ABP 2100ANP | PFAS-Free Die Attach Adhesive
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Formulated for Pb-free applications
- High hot/wet adhesion
- Excellent dispensability
Product Description
LOCTITE® ABLESTIK ABP 2100ANP is an electrically conductive die attach adhesive engineered for high-throughput, Pb-free Ball Grid Array (BGA) packaging. It's designed to withstand the high reflow temperatures (up to 260°C) required for Pb-free solders and meets automotive-grade standards. This adhesive is suitable for die sizes up to 12.7 mm x 12.7 mm and does not contain any intentionally added PFAS.
Recommended Cure Schedule
- 30 minutes ramp to 175°C + 15 minutes @ 175°C in N2
- 30 minutes ramp to 175°C + 30 minutes @ 175°C in N2
Product Key Features
- Electrically conductive
- High-temperature resistance — Withstands Pb-free reflow temperatures up to 260°C.
- Automotive grade — Meets rigorous reliability standards for automotive applications.
- PFAS-free — Does not contain intentionally added per- and polyfluoroalkyl substances.
Applications
- Pb-free BGA packaging
- Suitable for automotive components requiring high reliability and performance.
ABP2100ANP
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TDS, SDS & Technical Documents
- TDS LOCTITE ABLESTIK ABP 2100ANP issue 04-25
- LOCTITE ABLESTIK ABP 2100ANP 10CC SY NL-MSDS_UT_EN
- LOCTITE ABLESTIK ABP 2100ANP 10CC SY NL-MSDS_UT_NL
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Physical Properties
Additional Information
Thawing
- Allow container to reach room temperature before use.
- After removing from the freezer, set the syringes to stand vertically while thawing.
- Thaw times depend on the syringe size.
- Consult handling guide for more information.
- DO NOT open the container before contents reach 25°C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.
- DO NOT re-freeze. Once thawed to 25°C, the adhesive should not be re-frozen.
Directions for Use
- Thawed material should immediately be placed on dispense equipment for use.
- If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive.
- Adhesive must be completely used within the product's recommended work life.
- Alternate dispense amounts may be used depending on the application requirements.
- Star or crossed shaped dispense patterns will yield fewer bondline voids than the matrix style of dispense pattern.
