LOCTITE ABLESTIK ABP 6892

LOCTITE ABLESTIK ABP 6892 transparent non-conductive die attach BMI/Acrylate is designed to be used for fingerprint sensors. With its low stress and robust mechanical properties the ABP 6892 is targeted for applications that require the bonding of fingerprint sensors in credit cards (such as VISA, Mastercard and American Express), bank cards or other cards that require a secondary authentication process. Due to its low filler size (only a tiny % with max size less than 10um) and low viscosity it is ideal for wire bonding protection. Sensors and devices using the ABP 6892 die bonding material will have a greater resistance to delamination and overall improvement in package reliability.

LOCTITE ABLESTIK ABP 6892 transparent low stress, low modulus adhesive is ideal for ultra-thin glass or ceramic bonding or sensor dies up to 10x10mm. It has an improved flow for thin bond line (<15um) and excellent workability with a long opening (2 hours) and staging (8 hours) time. This thin bondline enables the better capturing of fingerprints and makes it ideal for optical sensors. This is only made better by the reflow resistant resistant refractive index of 1.50, minimal resin bleed out and low transmittance.

LOCTITE ABLESTIK ABP 6892 has also been used to protect the balls of Au wirebonds around the edge of a chip. ABP6892, when applied by jetting worked well and the low and fast cure time made it suitable for the production process also.

LOCTITE ABLESTIK ABP 6892 can cure below 80°C and provides a robust adhesion and void free bond line post 60°C/90% RH (96hrs) and HTS 120°C (100hrs).

Cure Schedule

• 15 minutes ramp to 80ºC, hold 60 minutes or
• 15 minutes ramp to 130ºC, hold 30 minutes