LOCTITE ABLESTIK ABP 8037TI

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Loctite Ablestik ABP8037TI

Main features

  • High-reliability LED manufacture
  • High thermal conductivity
  • Small die on Au-finish LF

Product Description

LOCTITE ABLESTIK ABP 8037TI silver-filled conductive adhesive is recommended for use in the attachment of integrated circuits and components onto metal leadframes and advanced substrates.

LOCTITE ABLESTIK ABP 8037TI silver-filled die attach adhesive paste is specifically designed to attach small diodes in high volume manufacturing. Even more specifically, it is the highest volume silver-filled die attach paste for high reliability LED attach and manufacture when using small die on Au-finished leadframes. Used in high-volume manufacturing throughout China and Malaysia.

LOCTITE ABLESTIK ABP 8037TI is similar to Loctite Ablestik ABP 8037T, with a minor raw material change that made it adjust its naming convention.

Cure Schedule

  • 30 minute ramp to 175ºC, hold 30 minutes @ 175 °C
  • 30 minute ramp to 150ºC, hold 30 minutes @ 150 °C

 

 

Product Family

ABP8037TI

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Catalog Product

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Packaging
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TDS, SDS & Technical Documents
  • LOCTITE ABLESTIK ABP 8037TI
    English (Technical Data Sheet (TDS))
  • LOCTITE ABLESTIK ABP 8037TI Halogen free
    English (Technical documents)
  • MSDS 2086640 en_GB
    English (Safety Data Sheet (SDS))
  • MSDS 2696726 en_GB
    English (Safety Data Sheet (SDS))
  • LOCTITE ABLESTIK ABP 8037 TI
    French (Safety Data Sheet (SDS))
  • LOCTITE ABLESTIK ABP 8037 TI NL-MSDS_UT_NL
    Dutch (Safety Data Sheet (SDS))
  • LOCTITE ABLESTIK ABP 8037 TI NL-MSDS_UT_NL (1)
    Dutch (Safety Data Sheet (SDS))

Technical Specifications

General Properties
Work life @25°C Work life @25°C
24 hours
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
46 °C
Thermal Conductivity Thermal Conductivity
4.1 W/m.K
Physical Properties
Thixotropic index Thixotropic index
5.8
Viscosity Viscosity
11,000 mPa.s

Additional Information

Specific Characteristics:

  • High Thermal Conductivity
  • High volume diode (LED) manufacturing
  • Completely supersedes ABP 8037T which has been discontinued
  • Very good on small die
  • Very good on gold (Au) finishing leadframes

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