LOCTITE ABLESTIK ABP 8064T
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Highest thermal conductivity
- Soft solder replacement
- Low outgassing
Product Description
LOCTITE ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It boasts one of the highest thermal conductivities among die attach pastes (22 W/mK) only to be beaten by sintering technology.
LOCTITE ABLESTIK ABP 8064T is a 85% filled, soft solder replacement with low outgassing and medium modulus that is stable in High temperatures and can be used for a wide range of packages sizes. Typically it can be applied, among others, to QFP and High power devices.
Cure Schedule
- 60 min ramp from 25°C to 180°C, hold 60 mins at 180°C in N2 oven
- 60 min ramp from 25°C to 140°C, hold 60 mins at 140°C in N2 oven
ABP8064T
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TDS, SDS & Technical Documents
- LOCTITE ABLESTIK ABP 8064T
- LOCTITE ABLESTIK ABP 8064T Moisture absorption data
- LOCTITE ABLESTIK 8064T SDS
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Additional Information
Adhesion properties of ABP8064T
It's stated clearly in the TDS that it needs a N2 oven. Is this a prerequisite? Can it be cured in a conventional oven and if so how will this change the cure schedule?
Many customers prefer to cure in Nitrogen, to protect components from oxidation. However, please look at the 8064T data package – slide 33. It states that cure in Air or Nitrogen is OK. Justification data is on slides 30 to 32. It’s rather mathematical, but shows that die shear strength is not significantly affected by the curing atmosphere.
Would this epoxy be suitable to attach a Au plated copper tab to a Ag plated aluminium heatsink?
It is difficult to say. Our recommendation for 5mmx5mm max size is based on Silicon to Cu leadframe. (Expansion Coefficients are very different – 3ppm/C vs. 18ppm/C, so we get a lot of stress from this). However, you are bonding Copper (18 ppm/C) to Aluminium (23 ppm/C), so the expansion mismatch is smaller (about 5ppm/c vs 15ppm/C). So we would say that its worth trying ABP8064T
