LOCTITE ABLESTIK ABP 8920TC
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- High MRT performance
- High thermal conductivity
- Controlled particle size
Product Description
LOCTITE ABLESTIK ABP 8920TC thermally conductive die attach paste is specially designed for applications requiring good thermal management and robust mechanical properties. It is a White BMI hybrid paste with good adhesion and small and controlled particle size.
LOCTITE ABLESTIK ABP 8920TC is an Alumina filled, electrically insulating adhesive that is ideal for BT, Copper, Silver, PPF and Alloy 42 substrates. It has relatively higher thermal conductivity than most die attach pastes at 3 W/mK.
Cure Schedule
- 30 minutes ramp to 175°C, hold for 1 hour in air or N2
ABP8920TC
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TDS, SDS & Technical Documents
- ABLESTIK ABP 8920TC-EN
- 2629468_MSDS_UT_GB_EN
