KESTER 2166-BN Soldering Flux
Harmonization Code : 29051200 | Propan-1-ol (propyl alcohol) and propan-2-ol (isopropyl alcohol)
Main features
- Halide-free formulation
- Superior surface insulation resistance
- Easy residue removal
Product Description
Kester 2166-BN is a halide-free, organic flux designed for automated soldering of circuit board assemblies. It provides excellent activity on bare copper and solder-coated boards while ensuring easy residue removal and superior compatibility with solder resists.
Product Key Features
- Contains no chlorides, bromides, phosphates, or highly corrosive materials
- Effective on both bare copper and solder-coated boards
- Outperforms typical water-soluble fluxes, ideal for SMT assemblies
- Works well with solder resists compared to other water-soluble fluxes.
Applications
- for high-speed, automated assembly lines.
- Provides reliable soldering for advanced surface mount (SMT) electronic assemblies.
- also ideal for bare copper & solder-coated boards
AP-2166BN
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TDS, SDS & Technical Documents
- Kester-2166-BN-Soldering-Flux-LFX-TDS-GL-EN-02Mar2021
- 4060015_MAES 2166-BN Soldering Flux SDS GHS UN_English
- 4060015_MAES 2166-BN Soldering Flux SDS GHS UN_Malay
Technical Specifications
General Properties
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