KESTER 958 Soldering Flux
Harmonization Code : 29051200 | Propan-1-ol (propyl alcohol) and propan-2-ol (isopropyl alcohol)
Main features
- Excellent for bare copper applications
- Conformal coating compatible
- Improves soldering performace
Product Description
Kester 958 is a no-clean, non-corrosive liquid flux specifically designed for wave soldering of conventional and surface mount circuit board assemblies. It delivers excellent soldering performance while leaving boards clean and dry, ensuring compatibility with post-process steps.
Product Key Features
- Leaves virtually no residue after soldering; boards exit wave solder machine dry and cosmetically clean
- Prevents interference with electrical testing and post-solder processes
- Non-corrosive and non-conductive
- Works well with most conformal coating products
Applications
-
Ideal for through-hole components
- Bare copper PCBs with OSP coating
AP-958
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 3 weeksPackaging
TDS, SDS & Technical Documents
- 4060040_MAES 958 Soldering Flux SDS GHS UN_Malay
- 4060040_MAES 958 Soldering Flux SDS GHS UN_English
- Kester-958-Soldering-Flux-LFX-TDS-GL-EN-26Feb2021
Technical Specifications
General Properties
Additional Information
Flux Application
958 can be applied to circuit boards by a spray, foam or dip process. Flux deposition should be 120 to 240 µg of solids/cm² (750 to 1500 µg of solids/in²). An air knife after the flux tank is recommended to remove excess flux from the circuit board and prevent dripping on the preheater surface for the Foam and Dip process.
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