KESTER 959T Soldering Flux
Harmonization Code : 29051200 | Propan-1-ol (propyl alcohol) and propan-2-ol (isopropyl alcohol)
Main features
- Excellent wetting
- Low rosin content
- Non-corrosive
Product Description
KESTER 959T is a no-clean, non-corrosive liquid flux formulated for wave soldering of both conventional and surface mount circuit board assemblies. Formulated to reduce micro-solderball formation, 959T liquid flux delivers superior soldering performance and cosmetic results.
Product Key Features
- Excellent wetting for high quality solder joints.
- Low rosin content (0.5%), improving solderability, heat stability, and and high surface insulation resistance.
- Non-corrosive
- Even residue distribution
Applications
- Wave soldering of conventional through-hole assemblies & surface mount technology (SMT) boards.
AP-959T
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 3 weeksPackaging
TDS, SDS & Technical Documents
- MAES 959T Soldering Flux TDS
- MAES 959T Soldering Flux SDS
Technical Specifications
General Properties
Thermal Properties
Additional Information
Flux Application
959T can be applied to circuit boards by a spray, foam, or dip process. Flux deposition should be 120 to 240ug of solids/cm2 (750 to 1500 ug/in2). An air knife after the flux tank is recommended to remove excess flux from the circuit board and prevent dripping on the preheated surface. 
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