KESTER EM808 Solder Paste
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Excellent solderability
- Print speed up to 150 mm/sec
- Excellent anti-slumping features
Product Description
KESTER EM808 is a lead-free, organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance. Batch after batch, EM808 provides hours of stable stencil life, tack time and repeatable brick definition. EM808's robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed. The activator package in the EM808 is very aggressive and provides superior wetting to OSP coated and Immersion silver boards.
Product Key Features
- Outstanding batch-to-batch consistency.
- Lead-free
- water-soluble formulation
- Excellent anti-slumping characteristics
Applications
- Stencil printing and enclosed head printing (88% metal)
AP-EM808
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Shipping in 3 weeksPackaging
TDS, SDS & Technical Documents
- Kester-EM808-Solder-Paste-SDP-TDS
- Kester-EM808-Solder-Paste-SDP-SDS
Technical Specifications
General Properties
Additional Information
Reflow Profile
The recommended reflow profile for EM808 made with SAC alloys is shown here. This profile is simply a guideline. Since EM808 is a highly active solder paste, it can solder effectively over a wide range of profiles. Your optimal profile may be different from the one shown based on your oven, board and mix of defects. Please contact MacDermid Alpha Technical Support if you need additional profiling advice.
Ramp Rate:
- ≤ 3 °C/sec
Preheat Zone:
- Temperature: 80–150 °C
- Duration: 40–60 seconds typical
Soak Zone:
- Temperature: 150–190 °C
- Duration: 60–120 seconds typical
Reflow Zone:
- Peak Temperature: 235 °C (±5 °C)
- Time above liquidus: 40–80 seconds typical
Total Profile Length:
- Approximately 3–5 minutes
