KESTER NF372-TB Soldering Flux
Harmonization Code : 29051200 | Propan-1-ol (propyl alcohol) and propan-2-ol (isopropyl alcohol)
Main features
- Provides good solderability at atmospheric temperature
- Zero-halogen & low solids formulation
- Safe for rework
Product Description
KESTER NF372-TB is a zero-halogen, no-clean, low solids liquid flux engineered for superior performance in demanding soldering operations. It's universally compatible with both leaded and lead-free alloys and is classified as ROL0 under the IPC J-STD-004B standard, ensuring minimal and safe residues.
NF372-TB Solder Flux is part of Kester’s high reliability product line and compatible with NP505-HR Solder Paste, RF550 Rework Flux and SELECT-10™ Selective Soldering Flux.
Product Key Features
- Zero-halogen & low solids
- Withstands long dwell times and high preheat temperatures
- Residues are minimal, clear, and non-tacky
- Fully compatible with a wide array of leaded and lead-free solder alloys
Applications
- Thick PCBs or applications requiring high thermal input.
AP-NF372TB
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Shipping in 3 weeksPackaging
TDS, SDS & Technical Documents
- Kester-NF372-TB-Soldering-Flux-LFX-TDS
- Kester-NF372-TB-Soldering-Flux-LFX-SDS
Technical Specifications
General Properties
Additional Information
Flux Application
Process Parameters
| Process Parameters | Recommendation |
| Flux Deposition | 600 to 1400 ug/in2 of solids (93 to 217 ug/cm2) |
| Top Side Board Temperature (Bottom Preheaters Only) |
75 to 120℃ |
| Top Side Board Temperature (Bottom and Top Preheaters Only) |
95 to 140℃ |
| Bottom Side Board Temperature | 0 to 32℃ vs top side board temperature |
| Recommended Preheat Profile | Straight tamp to top side board temperature |
| Conveyor Speed | 0.5 to 1/2 m/min (1.6 to 3.9 ft/min) |
| Solder Contact Time | 3 to 7 seconds |
| Solder Bath Temperature | 260 to 270℃ (500 to 518℉) for SnCu or SAC alloy 245 to 260℃ (473 to 500℉) for Sn63Pb37 alloy |
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