ALPHA OM-535
Harmonization Code : 3810.10.00 | Soldering, brazing or welding powders and pastes consisting of metal and other materials
Main features
- Enables elimination of a second or third reflow cycle
- 8+ Hour stencil life
- Compatible with all commonly used Pb-free surface finishes
Product Description
ALPHA OM-535 features a low-temperature solder paste technology that enables a single reflow application for the assemby of double-sided boards. It has excellent no-solder drip phenomena during the reflow process. ALPHA OM-535 with SBX02 alloy has been successfuly used with peak reflow profiles between 155 - 190℃. This version also shows a higher mechanical strength and drop shock resistance than SnBi0.4Ag alloy. The flux in ALPHA OM-535 has excellent electrical resistivity than exceeds industry standards.
ALPHA OM-535 enables the elimination of an extra wave or selective wave soldering process when temperature sensitive through-hole components are used in an assembly.
Product Key Features
- Increased daily throughput, eliminating the need for managing wave solder.
- Removes the need for an extra SMT process, which significantly lower the cost of producing an electronic assembly.
- The alloys yield very low voiding BGA solder joints, even when a traditional SAC alloy sphere is used.
Applications
Packaging
TDS, SDS & Technical Documents
- AP-OM535 SBX02 TDS
- AP-OM535 SBX02 SDS
Technical Specifications
General Properties
Additional Information
OM-535 Reflow Profile
Application
- STENCIL: Recommend ALPHA CUT, ALPHA NICKEL-CUT, ALPHA TETRABOND®, or ALPHA FORM stencils @ 0.100 mm - 0.150 mm (4-6 mil) thick for 0.4 - 0.5 mm (0.016” or 0.020”) pitch. Stencil design is subject to many process variables. Contact your local Alpha stencil site for advice.
- SQUEEGEE: Metal recommended
- PRESSURE: 0.21 - 0.36 kg/cm of blade (1.25 -2.0 Ibs/inch)
- SPEED: 25 – 100 mm per second (1 – 6 inches per second)
- PASTE ROLL: 1.5-2.0 cm diameter and make additions when roll reaches 1 cm (0.4”) diameter (min). Max roll size will depend upon blade.
- STENCIL RELEASE SPEED: 1 – 5 mm/sec
- LIFT HEIGHT: 8 – 14 mm(0.31 – 0.55”)
