Kester TSF-ULR18
Harmonization Code : 29051200 | Propan-1-ol (propyl alcohol) and propan-2-ol (isopropyl alcohol)
Main features
- Ultra-low residue
- No-clean formulation
- High reliability
Product Description
Kester TSF-ULR18 is a no-clean, ultra-low residue tacky flux designed to meet the demands of advanced semiconductor packaging. TSF-ULR18 addresses challenges in high-density miniaturization and ultra-fine interconnect processes where flux cleaning is difficult or unnecessary.
Product Key Features
- Ultra-low residue
- No-clean formulation
- High reliability
- Optimized for fine pitch; ideal for ultra-fine copper pillar and micro-ball bump flip chip IC packages
Applications
- Flip Chip on Lead Frame, Ultra Fine Pitch Cu Pillar Bump and Micro-Solder Bump, 2.5D, 3D Packaging, Flip Chip MEMs, and others Flip Chip Packaging that do not require flux cleaning.
Packaging
TDS, SDS & Technical Documents
- Kester-TSF-ULR18-ADVI-TDS-GL-EN-04Apr2022
- Kester SDS TSF-ULR18 Tacky Soldering Flux
Technical Specifications
Physical Properties
General Properties
Additional Information
Recommended Reflow Profile
The typical convection reflow profile for TSF-ULR18 use for various lead-free alloys such as Sn96.5Ag3.5, Sn99.3Cu0.7, SnAg1.8, Sn100 and other various SnAgCu alloys is shown here. This profile is simply a guideline. TSF-ULR18 was engineered to be versatile and robust for customer reflow process. The optimal profile varies depending on device, component design, fixture, package design and device defect challenges. Please contact us if you need additional profiling advice.
