Thermelt 195 | Low Pressure Molding (LPM)

Thermelt 195 Natural is a high-performance, solvent-free copolymer polyamide hot melt resin engineered for low pressure molding (LPM) in demanding industrial environments. Designed for electronic and electrical encapsulation, it provides exceptional mechanical strength, high hardness, and excellent thermal resistance, making it particularly well-suited for applications requiring structural rigidity and mechanical durability.

With a UL94 V-2 flammability rating, Thermelt 195 offers a balance between thermal stability and cost-effective flame resistance, ensuring safe operation in a variety of industrial and automotive settings. Its superior flow characteristics and fast cooling time enable high productivity in molding lines.

Typical Applications:

• Ruggedized overmolding of industrial electrical components
• Molding for high-strength connectors and terminal blocks
• Potting of sensors and automotive junctions with exposure to vibration and thermal cycling
• Products requiring compliance with glow-wire test standards