LOCTITE ABLESTIK CDF 530P
Harmonization Code : 7115.90.00.00 | Other articles of precious metal or of metal clad with precious metal : Other
Main features
- Electrically conductive
- Thermally conductive
- QFN, TQFP, eTQFP
Product Description
LOCTITE ABLESTIK CDF 530P, highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metal leadframes. This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes. It can be used in a variety of die sizes ranging from 3mm x 3mm to 8mm x 8mm .
LOCTITE ABLESTIK CDF 530P offers high MSL reliability, controlled fillet size and does not exhibit resin bleed out. It has good wetting and low warpage on large dies and is recommended for thin wafer handling applications. It comes in 15 (CDF 515P) and 30um and is typically used for QFN, TQFP and eTQFP package applications.
Cure Schedule
- 30 minute ramp from 25°C to 200°C, hold 60 minutes @ 200°C
- 30 minute ramp from 25°C to 175°C, hold 60 minutes @ 175°C
CDF530P
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TDS, SDS & Technical Documents
- ABLESTIKCDF500-EN
- 2126722_MSDS_UT_GB_EN
- LOCTITE ABLESTIK CDF 530P8C8
- LOCTITE ABLESTIK CDF 530P8C8
Technical Specifications
Thermal Properties
Electrical Properties
General Properties
Additional Information
CDF 500P - Die attach film property comparison
