LOCTITE ABLESTIK CDF 625P
Harmonization Code : 7115.90.00.00 | Other articles of precious metal or of metal clad with precious metal : Other
Main features
- Electrically conductive
- Thermally conductive
- Low warpage
Product Description
LOCTITE® ABLESTIK CDF 625P silver filled, die attach adhesive film is the most universal film, compatible with pre-cut wafer lamination equipment, recommended for large die applications. It is suitable for bonding integrated circuits and components with low warpage and good adhesion (>5MPA) on laminates and metal finishes. Furthermore, it has the lowest total cost of ownership and covers a wide die size range up to 10x10mm.
LOCTITE® ABLESTIK CDF 625P has a broad application space with controlled 25um bondline and a low modulus that is very close to Ablestik 8322A (2000 MPa @ RT, 40 MPa @ 250C.). This conductive die attach film can be effectively used for other applications and can also be a potentially replacement for QMI519.
Cure Schedule
- 30 minute ramp to 100°C + 30 minutes @ 100°C +
- 30 minute ramp to 175°C + 1 hour @ 175°C
CDF625P
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TDS, SDS & Technical Documents
- LOCTITE ABLESTIK CDF 600
- LOCTITE ABLESTIK CDF 625P8C8 25 PER RL NL-MSDS_UT_NL
- LOCTITE ABLESTIK CDF 625P8C8 25 PER RL EN-MSDS_UT_EN
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
How is CDF 625P packaged and "rolled?
Henkel has worked with its suppliers to improve the Conductive Die Attach Film (cDAF) product line by developing an edge tape layer to mitigate the occurrence of impression marks.
CDF 600P - Die attach film property comparison
