LOCTITE ABLESTIK CE3103WLV

LOCTITE® ABLESTIK CE 3103WLV is a rigid, Ag filled, one component electrically conductive epoxy adhesive that is a Lead free / Pb-free alternative to solder. It is compatible with non-noble metals and curable under standard solder reflow profiles.

LOCTITE® ABLESTIK CE 3103WLV can be cured using standard solder reflow profiles. Its low viscosity and anti corrosion technology makes it ideal for dispensing. Its operating temperature is -40 up to 150°C.

LOCTITE® ABLESTIK CE 3103WLV passes NASA outgassing standards and it can be used to bond Sn finished passives and components. Common applications include and are not limited to:

• Bonding of noble passive components onto noble terminated LTCC boards
• Bonding of Sn or AgSn coated Cu ribbon to front contact (TCO) of thin film PV cells

Cure Schedule

• 10min @ 120°C or
• 3min @ 150°C