LINQBOND DA-8410 | Die-Attach
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Main features
- High Thermal Conductivity
- High Reliability
- Pressureless sintering
Product Description
LINQBONDTM DA-8410 is a silver sintering die attach paste with excellent adhesion on bare Cu substrates, as well as other metal plated substrates. Pressureless sintering is achieved at 250 °C, providing excellent adhesion and leaving no organic residues, resulting in high thermal conductivity and reliability.
LINQBONDTM DA-8410 is designed as a die attach material for applications requiring high thermal and electrical conductivity. Typically used for high thermal resistance assemblies such as LEDs, laser diodes, RF devices, automotive electronics, and power devices.
Packaging
TDS, SDS & Technical Documents
- TDS_LINQBOND DA-8410
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
Cure schedule
Two-Step Curing Conditions (refer to the diagram below):
-
1st step: 5 °C/min ramp to 80 °C and hold for 30 min
-
2nd step: 5 °C/min ramp from 80 °C to 250 °C and hold for 60 min
-
Cool down: 5 to 10 °C/min cool down to room temperature
Precautions for Use
-
Allow the container to reach room temperature before use. Syringe should be placed vertically while thawing. Thaw process for 10 cc syringe takes 1 hour.
-
The adhesive cannot be refrozen once exposed to room temperature.
-
To ensure uniform and stable viscosity, syringe can be placed in planetary mixer for 2 min at 800 rpm.
-
Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.