LINQBOND DA-8410R | Die-Attach
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Main features
- Low resin bleed out
- excellent adhesion and reiliability
- Stencil printable
Product Description
LINQBOND™ DA-8410R is a one-component, silver-filled, conductive die attach adhesive. It provides excellent adhesion for Si die on various substrates and lead frame finishes, including Ag-plated surfaces, bare Cu, PPF, and ceramics. It offers minimal resin bleed-out, ensuring superior workability.
Engineered for high reliability, LINQBOND™ DA-8410R meets MSL3 to MSL1 standards and is ideal for IC die attach applications across industries such as consumer electronics, industrial automation, IoT, smart devices, automotive, military, and aerospace.
Packaging
TDS, SDS & Technical Documents
- TDS_LINQBOND DA-8410R
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
Curing Conditions
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30 minutes ramp to 185 °C and hold for 90 minutes
These conditions serve as a reference only. Please establish the curing conditions based on the product's specific requirements.
Thawing Instructions
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Remove the material from refrigeration and allow it to thaw completely before use.
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Place syringes in a vertical position while thawing.
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The thawing duration for a 5 cc to 10 cc syringe is 1 hour.
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Store the thawed material in an airtight container at room temperature.
General Directions for Use
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Do not refreeze the adhesive once it has been thawed to room temperature.
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Wear appropriate protective equipment and minimize direct skin contact.
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Refer to the Material Safety Data Sheet (SDS) before use for safety guidelines.
Storage and Handling
Store and transport at –40 °C. Keep away from fire and heat sources.
