DOWSIL™ SE 9168 RTV

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

DOWSIL™ SE 9168 RTV

Main features

  • Fast processing
  • Flame resistance
  • Controlled volatility

Product Description

DOWSIL™ SE 9168 RTV Adhesive is a one-part, gray, non-flowing polydimethylsiloxane adhesive designed to provide a fast tack-free room temperature cure. It offers controlled silicone volatility and good flame resistance, eliminating the need for curing ovens.

Product Key Features

  • One-Part Room Temperature Cure - cures quickly at room temperature, requiring no additional heat or curing ovens.
  • Fast Processing - features a rapid tack-free time of 6.5 minutes at 25°C to accelerate manufacturing throughput.
  • Flame Resistance - achieves a UL 94 V-0 flammability classification, making it suitable for applications requiring high flame resistance.
  • Controlled Volatility - maintains a low molecular siloxane (D4-D10) content of 35 ppm.
  • Mechanical & Electrical Profile - cures to deliver a Shore A hardness of 44, a tensile strength of 3.69 MPa (535 psi), an elongation of 363%, and a dielectric strength of 26 kV/mm.

Applications

This adhesive is suitable for electronic assemblies requiring fast room temperature curing, vibration dampening, and reliable flame resistance.

  • Circuit Boards & Modules: Ideal for fixing parts directly on circuit boards and within electronic modules.
  • Vibration Dampening: Effectively used for the vibration dampening of fixed components in electronic assemblies.
  • Flame Retardant Uses: Designed specifically for applications that demand added flame resistance and UL 94 V-0 compliance.
Product Family

DS-SE9168

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TDS, SDS & Technical Documents
  • 11-3273-01-dowsil-se-9168-rtv-adhesive
    English (Technical Data Sheet (TDS))
  • DOWSIL™ SE 9168 RTV-Safety Data Sheet-EN
    English (Safety Data Sheet (SDS))

Technical Specifications

General Properties
Color Color
Gray
Specific Gravity Specific Gravity
1.32
Physical Properties
Tack-Free Time Tack-Free Time
6.5 minutes
Viscosity Viscosity
non-flowing mPa.s
Mechanical Properties
Elongation Elongation
363 %
Electrical Properties
Dielectric Strength Dielectric Strength
26 kV/mm
Volume Resistivity Volume Resistivity
8.0 E+15 Ohms⋅cm
Thermal Properties
UL 94 Rating UL 94 Rating
V-0

Additional Information

Fast Tack-Free Room Temperature Cure Silicone

DOWSIL™ SE 9168 RTV Adhesive

DOWSIL™ SE 9168 RTV Adhesive is a premium one-part, gray, non-flowing silicone adhesive formulated for high-reliability applications requiring fast tack-free room temperature curing. Composed of polydimethylsiloxane, this thixotropic paste is engineered with controlled silicone volatility to limit low molecular siloxane outgassing and features a UL 94 V-0 flammability rating for superior flame resistance. It eliminates the need for curing ovens, providing excellent unprimed adhesion and vital stress relief for critical electronic modules and circuit board sub-assemblies.

One-part moisture cure 6.5 min tack-free time Controlled volatility (35 ppm) UL 94 V-0 Flammability
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Typical values only. Performance profiles are measured after full atmospheric moisture activation at room temperature settings.

DOWSIL SE 9168 RTV Adhesive product package
DOWSIL™ SE 9168 RTV Adhesive

Key Features

  • One-part moisture cure system bypasses oven operating steps and associated equipment costs.
  • Thixotropic non-flowing paste profile ensures dependable bead control and component isolation.
  • Fast room-temperature tack-free development (6.5 minutes) accelerates assembly throughput limits.
  • Controlled silicone volatility limits low molecular siloxanes to 35 ppm to protect sensitive circuits.
  • Certified UL 94 V-0 flammability rating provides superior in-service flame resistance.
  • Maintains structural and electrical insulation parameters across a wide range of -45°C to 200°C.

Processing Summary

Ease of Dispensing: Supplied as a ready-to-use gray industrial paste optimized for automated or manual needle dispense systems.
Skin & Tack Windows: Surface skin formation begins within a few minutes. Achieves a fast, non-tacky skin-over state in just 6.5 minutes at 25°C.
Inward Cure Progress: Once surface skinning initiates, moisture cure advances inward from the outer exposed edge at a rate of 0.25 inches (6.35 mm) per seven days.
Throughput Optimization: Part handling strength develops within 10 to 120 minutes. Mild heat below 60°C (140°F) can be introduced to safely quicken processing speeds.
Handling and Application Guidance

Process Notes 

Storage and Material Handling
  • Store unopened original packages at or below the temperature specified on the product label.
  • Take strict precautions to prevent any atmospheric moisture contact with raw material.
  • Minimize head air space and purge partially filled containers with dry nitrogen or dry air.
  • Verify the formal "Use Before" validation field marked on the package label prior to lines setup.
Surface Preparation
  • Clean substrate boundaries thoroughly with Dow OS fluids, naphtha, mineral spirits, or MEK.
  • Avoid using pure acetone or isopropyl alcohol (IPA) alone, as they do not remove heavy oils well.
  • Incorporate fine surface mechanical abrasion to maximize active bonding surface area[.
  • Chemical etching or plasma treatment methods can optimize hold on non-reactive profiles like Teflon, PE, or PP.
Cure Environment Factors
  • Cure processing advances evenly inward but is dependent on humidity levels (30% to 80% RH).
  • Avoid applying paste inside highly confined or fully enclosed layout zones restricted from air exposure.
  • Run lab-scale lap shear assessments to screen for 100% cohesive failure, ensuring component compatibility.
  • Screen highly plasticized plastics or rubbers; mobile plasticizers can act as active bond release agents.
Typical Properties

Engineering Data for DOWSIL™ SE 9168

Physical & Cured Mechanical Properties

Physical Property Typical Engineering Value Unit
Appearance / Color Non-flowing paste / Gray -
Tack-free Time (25 oC) 6.5  minutes
Specific Gravity (Cured) 1.32 -
Durometer Hardness 44 Shore A -
Tensile Strength 535 / 3.69 / 37   
Elongation 363  %
Lap Shear Adhesion (Glass) 275 / 1.9 / 189 psi/ MPa/(N/cm²) 
Low Molecular Siloxane Content (D4 - D10) 35  ppm 

Electrical & Flammability Performance Insulation

Insulating Attribute Typical Engineering Value Unit
Dielectric Strength 650 (26 ) volts/mil (kV/mm)
Volume Resistivity 8.0E+15  ohm*cm
UL Flammability Classification 94 V-0 -
Operational Temperature Range Capability
DOWSIL™ SE 9168 RTV Adhesive remains operational over a long-term service temperature spread of -45°C to 200°C (-49°F to 392°F). Thermal cycling extensions down to -55°C (-67°F) can be verified depending on individual configuration and stress sensitivities.
Applications

Where DOWSIL™ SE 9168 Fits

Component fixing on printed circuit board layout
Parts Fixing on PCBs
Perfectly configured across automated printed circuit board sub-assemblies to stabilize heavy or sensitive electronic components.
  • Provides safe, room temperature moisture curing loops.
  • Controlled volatility safeguards complex circuit tracks from outgassing.
  • Unprimed dính bám secures common electronic materials.
Vibration dampening of electronic assemblies
Vibration Dampening
Acts as a durable, stress-relieving mechanical cushion stabilizing fixed board components against vibrational harmonics.
  • Forms a tough yet highly flexible rubber structural seal.
  • Absorbs thermal expansions under shifting assembly conditions.
  • Resists micro-shocks without losing baseline boundary line hold.
Flame resistant module encapsulation sealing
Flame Resistant Modules
Intended for electronic modules and protective enclosure pathways requiring strict safety standard compliance.
  • Certified UL 94 V-0 flammability classification rating.
  • Thixotropic paste rheology prevents slumping on vertical runs.
  • Intended to successfully survive splash or intermediate solvent exposure.
Product Demo

See One-Part Moisture-Curing RTV Silicone Dispensing Methods

Observe the high-precision processing of one-part non-flowing industrial RTV silicone adhesive sealants via automated needle dispensing setups. This practical reference highlights best practices for balancing track extrusion parameters, checking non-slump bead profiles, and verifying surface handling stability before complete room temperature cross-linking completes.

Package & Support

Standard Packaging & Technical Help

Standard Container Sizes
  • Available in multiple industrial protective packaging container choices to suit your automation requirements.
  • Supplied ready-to-use without requiring volatile pre-mixing setups or compound volumetric calculations.
  • Logistics configurations safeguard elements, maintaining a sealed environment away from humidity activation.
Technical Help Capabilities
  • Assisting manufacturing lines with room-temperature tuning to fully eliminate capital oven operations.
  • Evaluating complex component layouts to optimize unprimed over engineering plastic matrices.
  • Configuring automated needle path tracking setups to maximize processing throughput.
  • Guidance regarding regulatory safety data and formal UL flammability certification matching.
Technical Guidance

Tips and Troubleshooting

Issue Recommended Action
Premature layer skinning or surface tearing during finishing tooling steps
  • Surface skin over progresses fast, typically commencing until a surface skin begins to form within an hour.
  • Ensure any smoothing adjustments or spatula profiling operations are completed within the active working window.
  • Perform assembly component joins swiftly after extrusion to guarantee complete adhesive transfer before a skin forms.
Incomplete structural cross-linking down through joint core zones
  • One-part RTV chemical cross-linking relies strictly on atmospheric moisture and progresses inward from the exterior skin
  • Do not utilize this moisture-cure product in highly confined or enclosed pockets lacking proper air access.
  • Be aware that deep-section cure dimensions advance at a standard parameter rate of 0.25 inches per seven days.
  • Expect extended cure tracking behaviors if the plant floor surrounding relative humidity indices fall low.
Adhesion tracking breakdown or low lap shear force values over difficult substrates
  • Unprimed structural bonds will not stick successfully onto non-reactive substrates like Teflon, polyethylene, or polypropylene.
  • Highly plasticized plastics or rubbers can leach mobile plasticizers over time, which act as unwanted bond release agents.
  • Verify all targets are cleanly washed of mill fluids or grease using Dow OS fluids, naphtha, mineral spirits, or MEK.
  • Apply specialized surface configurations such as chemical etching, inline plasma treatment, or compatible Dow Primers.
Next Steps

Ready to Qualify DOWSIL™ SE 9168?

Share your material performance, joint profile designs, and manufacturing assembly constraints with us. Tell us about your quality control parameters, ambient shop environment limits, and volume expectations. Our application engineers are prepared to assist your team with processing tests to confirm reliable mechanical results on your line.

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