DOWSIL™ SE 9168 RTV
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

Main features
- Fast processing
- Flame resistance
- Controlled volatility
Product Description
DOWSIL™ SE 9168 RTV Adhesive is a one-part, gray, non-flowing polydimethylsiloxane adhesive designed to provide a fast tack-free room temperature cure. It offers controlled silicone volatility and good flame resistance, eliminating the need for curing ovens.
Product Key Features
- One-Part Room Temperature Cure - cures quickly at room temperature, requiring no additional heat or curing ovens.
- Fast Processing - features a rapid tack-free time of 6.5 minutes at 25°C to accelerate manufacturing throughput.
- Flame Resistance - achieves a UL 94 V-0 flammability classification, making it suitable for applications requiring high flame resistance.
- Controlled Volatility - maintains a low molecular siloxane (D4-D10) content of 35 ppm.
- Mechanical & Electrical Profile - cures to deliver a Shore A hardness of 44, a tensile strength of 3.69 MPa (535 psi), an elongation of 363%, and a dielectric strength of 26 kV/mm.
Applications
This adhesive is suitable for electronic assemblies requiring fast room temperature curing, vibration dampening, and reliable flame resistance.
- Circuit Boards & Modules: Ideal for fixing parts directly on circuit boards and within electronic modules.
- Vibration Dampening: Effectively used for the vibration dampening of fixed components in electronic assemblies.
- Flame Retardant Uses: Designed specifically for applications that demand added flame resistance and UL 94 V-0 compliance.
Packaging
TDS, SDS & Technical Documents
- 11-3273-01-dowsil-se-9168-rtv-adhesive
- DOWSIL™ SE 9168 RTV-Safety Data Sheet-EN
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Electrical Properties
Thermal Properties
Additional Information
DOWSIL™ SE 9168 RTV Adhesive
DOWSIL™ SE 9168 RTV Adhesive is a premium one-part, gray, non-flowing silicone adhesive formulated for high-reliability applications requiring fast tack-free room temperature curing. Composed of polydimethylsiloxane, this thixotropic paste is engineered with controlled silicone volatility to limit low molecular siloxane outgassing and features a UL 94 V-0 flammability rating for superior flame resistance. It eliminates the need for curing ovens, providing excellent unprimed adhesion and vital stress relief for critical electronic modules and circuit board sub-assemblies.
Typical values only. Performance profiles are measured after full atmospheric moisture activation at room temperature settings.
Key Features
- One-part moisture cure system bypasses oven operating steps and associated equipment costs.
- Thixotropic non-flowing paste profile ensures dependable bead control and component isolation.
- Fast room-temperature tack-free development (6.5 minutes) accelerates assembly throughput limits.
- Controlled silicone volatility limits low molecular siloxanes to 35 ppm to protect sensitive circuits.
- Certified UL 94 V-0 flammability rating provides superior in-service flame resistance.
- Maintains structural and electrical insulation parameters across a wide range of -45°C to 200°C.
Processing Summary
Process Notes
- Store unopened original packages at or below the temperature specified on the product label.
- Take strict precautions to prevent any atmospheric moisture contact with raw material.
- Minimize head air space and purge partially filled containers with dry nitrogen or dry air.
- Verify the formal "Use Before" validation field marked on the package label prior to lines setup.
- Clean substrate boundaries thoroughly with Dow OS fluids, naphtha, mineral spirits, or MEK.
- Avoid using pure acetone or isopropyl alcohol (IPA) alone, as they do not remove heavy oils well.
- Incorporate fine surface mechanical abrasion to maximize active bonding surface area[.
- Chemical etching or plasma treatment methods can optimize hold on non-reactive profiles like Teflon, PE, or PP.
- Cure processing advances evenly inward but is dependent on humidity levels (30% to 80% RH).
- Avoid applying paste inside highly confined or fully enclosed layout zones restricted from air exposure.
- Run lab-scale lap shear assessments to screen for 100% cohesive failure, ensuring component compatibility.
- Screen highly plasticized plastics or rubbers; mobile plasticizers can act as active bond release agents.
Engineering Data for DOWSIL™ SE 9168
Physical & Cured Mechanical Properties
| Physical Property | Typical Engineering Value | Unit |
|---|---|---|
| Appearance / Color | Non-flowing paste / Gray | - |
| Tack-free Time (25 oC) | 6.5 | minutes |
| Specific Gravity (Cured) | 1.32 | - |
| Durometer Hardness | 44 Shore A | - |
| Tensile Strength | 535 / 3.69 / 37 | |
| Elongation | 363 | % |
| Lap Shear Adhesion (Glass) | 275 / 1.9 / 189 | psi/ MPa/(N/cm²) |
| Low Molecular Siloxane Content (D4 - D10) | 35 | ppm |
Electrical & Flammability Performance Insulation
| Insulating Attribute | Typical Engineering Value | Unit |
|---|---|---|
| Dielectric Strength | 650 (26 ) | volts/mil (kV/mm) |
| Volume Resistivity | 8.0E+15 | ohm*cm |
| UL Flammability Classification | 94 V-0 | - |
Where DOWSIL™ SE 9168 Fits
- Provides safe, room temperature moisture curing loops.
- Controlled volatility safeguards complex circuit tracks from outgassing.
- Unprimed dính bám secures common electronic materials.
- Forms a tough yet highly flexible rubber structural seal.
- Absorbs thermal expansions under shifting assembly conditions.
- Resists micro-shocks without losing baseline boundary line hold.
- Certified UL 94 V-0 flammability classification rating.
- Thixotropic paste rheology prevents slumping on vertical runs.
- Intended to successfully survive splash or intermediate solvent exposure.
See One-Part Moisture-Curing RTV Silicone Dispensing Methods
Observe the high-precision processing of one-part non-flowing industrial RTV silicone adhesive sealants via automated needle dispensing setups. This practical reference highlights best practices for balancing track extrusion parameters, checking non-slump bead profiles, and verifying surface handling stability before complete room temperature cross-linking completes.
Standard Packaging & Technical Help
- Available in multiple industrial protective packaging container choices to suit your automation requirements.
- Supplied ready-to-use without requiring volatile pre-mixing setups or compound volumetric calculations.
- Logistics configurations safeguard elements, maintaining a sealed environment away from humidity activation.
- Assisting manufacturing lines with room-temperature tuning to fully eliminate capital oven operations.
- Evaluating complex component layouts to optimize unprimed over engineering plastic matrices.
- Configuring automated needle path tracking setups to maximize processing throughput.
- Guidance regarding regulatory safety data and formal UL flammability certification matching.
Tips and Troubleshooting
| Issue | Recommended Action |
|---|---|
| Premature layer skinning or surface tearing during finishing tooling steps |
|
| Incomplete structural cross-linking down through joint core zones |
|
| Adhesion tracking breakdown or low lap shear force values over difficult substrates |
|
