DOWSIL™ TC-5026 Thermally Conductive Compound
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Ultra-thin bondline capability of approximately 0.007 mm
- Suitable for CPU, GPU, MPU, ASIC, and processor
- Flowable silicone compound
Product Description
DOWSIL™ TC-5026 Thermally Conductive Compound is a high-performance, one-part, non-curing silicone thermal compound engineered to provide efficient heat transfer between processors and heat sinks in high-power electronic devices. Featuring 2.9 W/m·K thermal conductivity, very low thermal resistance of 0.03 °C·cm²/W, and the ability to achieve an ultra-thin bondline thickness of approximately 0.007 mm (0.3 mil) under compression, TC-5026 helps maximize thermal performance in space-constrained applications. Its solventless, grease-like formulation eliminates the need for curing ovens while maintaining excellent surface wet-out and long-term thermal stability. Designed specifically for microprocessor cooling, TC-5026 is well suited for servers, desktop computers, notebooks, gaming consoles, and other electronics requiring reliable processor-to-heat-sink thermal management.
Key Features
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2.9 W/m·K thermal conductivity for efficient heat dissipation.
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Ultra-low thermal resistance of 0.03 °C·cm²/W at 40 psi.
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Non-curing formulation eliminates oven curing requirements.
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Flowable silicone compound promotes excellent surface wet-out.
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Ultra-thin bondline capability of approximately 0.007 mm (0.3 mil).
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Solventless formulation with 99.95% non-volatile content.
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Maintains a positive heat sink seal for improved thermal transfer.
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Electrically insulating with 8.9 kV/mm dielectric strength.
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High volume resistivity of 5.9 × 10¹¹ Ω·cm.
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Suitable for CPU, GPU, MPU, ASIC, and processor cooling applications.
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Designed for servers, desktops, notebooks, gaming consoles, and high-performance computing systems.
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Supports improved device efficiency and long-term reliability through effective thermal management.
DS-TC5026
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TDS, SDS & Technical Documents
- 11-3435-01-dowsil-tc-5026-thermally-conductive-compound
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Additional Information
DOWSIL™ TC-5026: High-Performance Thermally Conductive Compound
DOWSIL™ TC-5026 Thermally Conductive Compound is a gray, flowable, non-curing silicone thermal compound designed to provide efficient heat transfer for microprocessor cooling in servers, desktops, notebooks, and game consoles. With 2.9 W/m·K thermal conductivity, very low thermal resistance, and the ability to achieve thin bondline thickness, TC-5026 helps conduct heat away from sensitive components and improve thermal efficiency in compact, high-performance electronic systems.
Thin bondline thermal performance — TC-5026 provides 2.9 W/m·K thermal conductivity and 0.03 °C·cm²/W thermal resistance at 40 psi for efficient processor-to-heat-sink heat transfer.
Its non-curing, solventless formulation eliminates the need for curing ovens and supports direct application as a grease-like thermal interface between heat-generating devices and heat sinks or chassis.
Thermal compound for processor cooling — suitable for MPUs, CPUs, GPUs, server processors, desktop systems, notebooks, and game consoles where low thermal resistance and thin bondlines are required.
TC-5026 acts as a thermal bridge between the heat source and heat sink, helping improve device efficiency, reduce operating temperature, and support long-term electronic reliability.
2.9 W/m·K Thermal Conductivity • Non-Curing • Very Low Thermal Resistance • Thin BLT Capability
Features & Benefits
- 2.9 W/m·K thermal conductivity — supports efficient heat transfer.
- Very low thermal resistance — 0.03 °C·cm²/W at 40 psi.
- Non-curing formulation — no curing ovens required.
- Flowable compound — supports easy application and interface wet-out.
- Thin BLT capability — achieves approximately 0.007 mm at 40 psi.
- Solventless formulation — high non-volatile content of 99.95%.
- Electrically insulating — dielectric strength of 8.9 kV/mm.
- Processor cooling optimized — designed for MPU cooling in servers, desktops, notebooks, and game consoles.
Typical Applications
- Server processor cooling.
- Desktop CPU thermal interfaces.
- Notebook processor thermal management.
- Game console processor and GPU cooling.
- MPU-to-heat-sink interfaces.
- PCB assembly thermal management.
- Heat sink or chassis thermal coupling.
Thermal Challenges in High-Performance Computing Devices
As servers, desktops, notebooks, and game consoles continue to deliver higher performance in smaller designs, processors generate more heat in limited spaces. DOWSIL™ TC-5026 helps address this challenge by forming a low-resistance thermal bridge between the heat source and the heat sink, enabling efficient heat removal and supporting improved device reliability.
Engineering Data for DOWSIL™ TC-5026
| Property | DOWSIL™ TC-5026 | Condition / Note |
|---|---|---|
| Type | One-part compound | Non-curing thermal compound |
| Color | Gray | Typical appearance |
| Viscosity | 100 Pa·s | 100,000 cP / mPa·s |
| Specific Gravity | 3.5 | Uncured |
| Non-Volatile Content | 99.95% | NVC |
| Thermal Conductivity | 2.9 W/m·K | 1.7 BTU/hr-ft-°F |
| Thermal Resistance | 0.03 °C·cm²/W | At 40 psi |
| Bondline Thickness | 0.007 mm / 0.3 mil | At 40 psi |
| Dielectric Strength | 8.9 kV/mm | 227 volts/mil |
| Volume Resistivity | 5.9E+11 ohm·cm | Electrical insulation |
| Dielectric Constant | 7.4 | At 1 kHz |
*Typical properties are not intended for specification writing. Verify performance under actual application, assembly pressure, bondline thickness, and reliability conditions.
Where DOWSIL™ TC-5026 Fits
- Servers
- Workstations
- Desktop computers
- Notebook CPUs
- Compact heat sinks
- Thin BLT interfaces
- Game consoles
- MPU cooling
- GPU thermal interfaces
How TC-5026 Supports Processor Thermal Design
| Design Challenge | DOWSIL™ TC-5026 Benefit |
|---|---|
| High-performance processors generate concentrated heat. | 2.9 W/m·K thermal conductivity helps transfer heat away from sensitive components. |
| Thick thermal interfaces increase thermal resistance. | Thin BLT capability helps optimize processor-to-heat-sink performance. |
| Cure steps add time and process complexity. | Non-curing formulation eliminates curing ovens and simplifies assembly. |
| Poor interface contact creates thermal bottlenecks. | Flowable compound supports surface wet-out and maintains a positive heat sink seal. |
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