DOWSIL™ TC-5515 LT Low Density Thermal Conductive Gap Filler
Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others
Main features
- Low Density, Soft, & Compliant cured material
- Room-temperature cure in 360 minutes at 25°C
- Tacky surface after cure
Product Description
DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a two-part, room-temperature-curing silicone gap filler designed for lightweight thermal management in EV modules, printed circuit boards, control units, and other heat-generating electronic assemblies. With 2.0 W/m·K thermal conductivity, low cured specific gravity of 1.95, and UL 94 V-0 recognition, TC-5515 LT helps transfer heat from electronic devices to aluminum housings or heat sinks while reducing added module weight. Once cured, the material forms a soft, compliant, and tacky interface that provides stress relief in vibration applications, holds vertical position, supports rework after assembly, and maintains reliable performance across a working temperature range of -40°C to 150°C.
Key Features
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2.0 W/m·K thermal conductivity for reliable heat dissipation.
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Low density with cured specific gravity of 1.95.
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Two-part 1:1 mix ratio by weight or volume.
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Room-temperature cure in 360 minutes at 25°C.
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Heat-accelerated cure in 30 minutes at 80°C.
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Soft, compliant cured material for vibration stress relief.
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Non-flowable behavior on flat and vertical surfaces.
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Tacky surface after cure for easier rework after assembly.
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UL 94 V-0 recognition for flame-rated electronics applications.
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Excellent dielectric strength of 19 kV/mm.
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High volume resistivity of ≥1.0 × 10¹³ Ω·cm.
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Working temperature range of -40°C to 150°C.
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Suitable for EV modules, PCB assemblies, control units, battery modules, aluminum housings, and heat sink interfaces.
DS-TC5515
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TDS, SDS & Technical Documents
- 80-8559-01-dowsil-tc-5515-lt-low-density-thermal-conductive-gap-filler
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
DOWSIL™ TC-5515 LT: Low Density Thermally Conductive Gap Filler for EV Modules
DOWSIL™ TC-5515 LT Low Density Thermally Conductive Gap Filler is a two-part, room-temperature-curing silicone gap filler designed to dissipate heat from EV modules, printed circuit boards, and other heat-generating electronic components. With 2.0 W/m·K thermal conductivity, low cured specific gravity of 1.95, UL 94 V-0 recognition, and a soft compliant cured form, TC-5515 LT helps provide reliable thermal transfer while reducing weight and mechanical stress in battery packs, control units, and electronic modules.
Lightweight thermal gap filling for EV and electronics reliability — TC-5515 LT combines 2.0 W/m·K thermal conductivity, low density, soft compliance, and vertical stability for reliable module cooling.
Once cured, the material remains soft and tacky for easy rework, while providing dielectric insulation, environmental protection, and stress relief against vibration, shock, and thermal cycling.
Designed for EV battery and control unit modules — suitable for transferring heat from EV modules, PCB-mounted components, and power electronics to aluminum housings or heat sinks.
The low-density silicone formulation supports lightweight thermal management while maintaining stable performance across demanding temperature and vibration environments.
2.0 W/m·K Thermal Conductivity • Low Density 1.95 • UL 94 V-0 • -45 °C to 150 °C Operation
Features & Benefits
- 2.0 W/m·K thermal conductivity — supports reliable heat dissipation.
- Low density — cured specific gravity of 1.95 for weight-sensitive designs.
- Room-temperature cure — cures in 360 minutes at 25 °C.
- Heat-accelerated cure — cures in 30 minutes at 80 °C.
- Soft and compliant — provides stress relief in vibration applications.
- Non-flowable after dispense — holds position on flat and vertical surfaces.
- Surface tacky after cure — supports rework after curing and assembly.
- UL 94 V-0 recognition — suitable for flame-rated electronic assemblies.
Typical Applications
- EV battery module thermal management.
- EV control unit modules.
- PCB-to-aluminum housing thermal interfaces.
- Automotive electronics and power modules.
- Component-to-heat-sink gap filling.
- Lightweight electronics thermal management.
- Vibration-sensitive module assemblies.
Thermal Challenges in Lightweight EV Modules
EV battery and control unit modules require thermal materials that can dissipate heat while limiting added weight and protecting sensitive electronics from mechanical stress. DOWSIL™ TC-5515 LT helps address these needs with a low-density silicone gap filler that transfers heat from EV modules, printed circuit boards, and other heat-generating components to aluminum housings or heat sinks.
Engineering Data for DOWSIL™ TC-5515 LT
| Property | DOWSIL™ TC-5515 LT | Condition / Note |
|---|---|---|
| Type | Two-part silicone gap filler | Low density thermally conductive material |
| Mix Ratio | 1:1 | By weight or volume |
| Color | Part A: White Part B: Blue |
Typical appearance |
| Mixed Viscosity | 140 Pa·s | At 10 s-1 |
| Thixotropic Index | 3.5 | 1 s-1 / 10 s-1 |
| Working Time | 90 minutes | At 25 °C |
| Specific Gravity, Cured | 1.95 | Low density |
| Thermal Conductivity | 2.0 W/m·K | Hot Disk |
| Cure Time | 360 minutes | At 25 °C |
| Heat-Accelerated Cure | 30 minutes | At 80 °C |
| Hardness | Shore 00 65 | Soft compliant material |
| Dielectric Strength | 19.0 kV/mm | Cured material |
| Volume Resistivity | ≥ 1.0E+13 ohm·cm | Electrical insulation |
| Lap Shear Strength | 0.20 MPa | Aluminum to aluminum |
| Shear Modulus | 0.27 MPa | DMA |
| Minimum BLT | 142 µm at 0.14 MPa 127 µm at 0.42 MPa |
Bondline thickness data |
| UL Flame Classification | UL 94 V-0 | Recognized classification |
| Shelf Life | 9 months | At 25 °C |
*Typical properties are not intended for specification writing. Verify performance under actual application, substrate, assembly, compression, cure, and reliability conditions.
Where DOWSIL™ TC-5515 LT Fits
- Battery modules
- Cell-to-plate interfaces
- Thermal management assemblies
- EV control units
- PCB-mounted components
- Aluminum housing interfaces
- Vertical gaps
- Automated dispensing
- Reworkable module assemblies
Mixing, Dispensing & Cure
Mixing
Mix Part A and Part B at a 1:1 ratio by weight or volume. A static mixer is recommended for manual and automated dispensing.
Dispensing
The thixotropic, non-flowable material is designed to remain in position after dispensing, including flat and vertical applications.
Curing
Cures in 360 minutes at 25 °C or can be heat accelerated to 30 minutes at 80 °C. No post-cure is required after cure completion.
How TC-5515 LT Supports EV Module Design
| Design Challenge | DOWSIL™ TC-5515 LT Benefit |
|---|---|
| EV modules require thermal transfer with reduced added weight. | Low specific gravity of 1.95 supports lightweight thermal gap filling. |
| Vibration and thermal cycling can stress sensitive components. | Soft compliant silicone provides stress relief after cure. |
| Thermal material must stay in place during assembly. | Non-flowable behavior supports flat and vertical dispensing conditions. |
| Module assemblies may require serviceability after cure. | Tacky cured surface helps enable easier rework after assembly. |
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