DOWSIL™ TC-6010 Thermally Conductive Encapsulant

Harmonization Code : 3910.00.00.90 | Silicones in Primary Forms; Others

DOWSIL™ TC-6010 Thermally Conductive Encapsulant

Main features

  • Flowable and self-leveling formulation
  • Excellent dielectric strength of 22 kV/mm
  • 1.2 W/m·K thermal conductivity

Product Description

DOWSIL™ TC-6010 Thermally Conductive Encapsulant is a two-part, flowable silicone encapsulation material designed to provide both thermal management and environmental protection for electronic and electrical assemblies. Featuring 1.2 W/m·K thermal conductivity, excellent dielectric strength of 22 kV/mm, and a self-leveling formulation, TC-6010 effectively dissipates heat from sensitive components while protecting them against vibration, moisture, contaminants, and electrical stress. The material cures with heat to form a soft, elastic silicone rubber that accommodates thermal expansion mismatch and enhances long-term reliability in demanding operating environments. Designed for automated or manual dispensing, TC-6010 is particularly well suited for on-board chargers, inverters, converters, transformers, power electronics, and PCB assemblies where both thermal performance and component protection are critical.

Key Features

  • 1.2 W/m·K thermal conductivity for efficient heat dissipation.

  • Two-part silicone encapsulant with a simple 1:1 mix ratio.

  • Flowable and self-leveling formulation for complete component coverage.

  • Heat-curing silicone elastomer forms a flexible protective encapsulant.

  • Excellent dielectric strength of 22 kV/mm for electrical insulation.

  • High volume resistivity of 3.2 × 10¹² Ω·cm for circuit protection.

  • UL 94 V-0 flame rating for enhanced safety compliance.

  • Soft Shore A 37 elastomer helps absorb vibration and mechanical stress.

  • 2.5-hour working time at room temperature for processing flexibility.

  • Compatible with automated and manual dispensing systems.

  • Operating temperature range of -45°C to 150°C for long-term reliability.

  • Suitable for on-board chargers (OBC), DC-DC converters, inverters, transformers, power electronics modules, PCB assemblies, energy storage systems, and industrial electrical equipment.

Product Family

DS-TC6010

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TDS, SDS & Technical Documents
  • 11-4253-01-dowsil-tc-6010-thermally-conductive-encapsulant
    English (Technical Data Sheet (TDS))

Technical Specifications

General Properties
Color Color
Part A: White | Part B: Blue
Component System Component System
Two Part
Mix Ratio Mix Ratio
1:1
Pot Life Pot Life
@25°C 2.5 hours
Specific Gravity Specific Gravity
1.67
Physical Properties
Viscosity (Part A) Viscosity (Part A)
2400 mPa.s
Viscosity (Part B) Viscosity (Part B)
2400 mPa.s
Mechanical Properties
Elongation Elongation
50 %
Thermal Properties
Thermal Conductivity Thermal Conductivity
1.2 W/m.K
UL 94 Rating UL 94 Rating
V0
Electrical Properties
Dielectric Strength Dielectric Strength
22 kV/mm
Volume Resistivity Volume Resistivity
3.20E+12 Ohms⋅cm

Additional Information

DOWSIL™ TC-6010: Thermally Conductive Encapsulant for Power Electronics

DOWSIL™ TC-6010 Thermally Conductive Encapsulant is a two-part, flowable silicone encapsulant designed to provide both thermal dissipation and electrical protection for electronic and electric components. With 1.2 W/m·K thermal conductivity, UL 94 V-0 flammability classification, excellent dielectric strength, and self-leveling flow after dispensing, TC-6010 is suitable for on-board chargers, inverters, converters, transformers, and other power electronics modules requiring heat dissipation from sensitive components.

Flowable encapsulation with thermal protection — TC-6010 combines 1.2 W/m·K thermal conductivity, self-leveling flow, elastic silicone protection, and strong dielectric insulation for power electronics assemblies.

The two-part silicone system cures with heat to form an elastic, thermally conductive rubber that helps protect sensitive circuits while transferring heat away from components.

Designed for encapsulating heat-generating electronics — suitable for power conversion modules, on-board chargers, inverter/converter assemblies, transformers, and PCB system assemblies.

TC-6010 fills and self-levels after dispensing, making it suitable for automated or manual mixing and dispensing processes where component coverage, dielectric protection, and thermal transfer are required.

DOWSIL TC-6010 thermally conductive encapsulant for power electronics

1.2 W/m·K Thermal Conductivity • Flowable & Self-Leveling • UL 94 V-0 • 22 kV/mm Dielectric Strength

Features & Benefits

  • 1.2 W/m·K thermal conductivity — helps dissipate heat from sensitive components.
  • Two-part silicone encapsulant — cures into elastic, thermally conductive rubber.
  • Flowable and self-leveling — able to fill after dispensing.
  • Versatile heat cure — 60 minutes at 60 °C or 30 minutes at 100 °C.
  • Excellent dielectric strength — 22 kV/mm for electrical insulation.
  • UL 94 V-0 flammability classification — suitable for flame-rated electronics assemblies.
  • Automated or manual dispensing — supports flexible processing.
  • Elastic silicone protection — helps protect electronics over a broad temperature range.

Typical Applications

  • On-board chargers.
  • Inverter and converter modules.
  • Transformers.
  • Power electronics assemblies.
  • Electronic and electric components.
  • PCB system assembly protection.
  • Thermally conductive encapsulation.
Power Electronics Encapsulation Perspective

Thermal and Electrical Protection for Power Modules

Power electronics such as on-board chargers, inverters, converters, and transformers require materials that can protect sensitive components while helping remove heat generated during operation. DOWSIL™ TC-6010 helps address these needs with a flowable silicone encapsulant that fills around components, cures to an elastic thermally conductive rubber, and provides durable dielectric insulation.

Thermal Dissipation
1.2 W/m·K thermal conductivity helps transfer heat away from sensitive electronic components.
Self-Leveling Fill
Flowable material fills and levels after dispensing, supporting component coverage in encapsulation processes.
Electrical Protection
High dielectric strength and silicone elastomer protection help insulate and protect sensitive circuits.
Typical Properties

Engineering Data for DOWSIL™ TC-6010

Property DOWSIL™ TC-6010 Condition / Note
Type Two-part encapsulant Thermally conductive silicone elastomer
Mix Ratio 1:1 By weight
Color Part A: White
Part B: Blue
Typical appearance
Viscosity Part A: 2400 mPa·s
Part B: 2400 mPa·s
Mixed: 2700 mPa·s
Flowable material
Heat Cure Time 60 min at 60 °C
30 min at 100 °C
Cure should be validated in customer application
Specific Gravity, Cured 1.67 At 25 °C
Pot Life / Working Time 2.5 hours At 25 °C
Hardness Shore A 37 Elastic cured rubber
Thermal Conductivity 1.2 W/m·K At 25 °C
Tensile Strength 0.93 MPa Typical value
Elongation 50% Elastic silicone behavior
Dielectric Strength 22 kV/mm Electrical insulation
Volume Resistivity 3.20E+12 ohm·cm Typical value
CTE 174 ppm/K -40 °C to 150 °C
UL Flammability Classification UL 94 V-0 Flame-rated assemblies
Useful Temperature Range -45 °C to 150 °C Long-term operation guidance

*Typical properties are not intended for specification writing. Cure condition and performance should be tested and optimized under actual customer application and curing environment.

Applications

Where DOWSIL™ TC-6010 Fits

On-Board Chargers
Flowable encapsulation supports thermal and electrical protection for OBC power electronics.
  • OBC modules
  • Power conversion circuits
  • Component protection
Inverter & Converter Modules
Thermally conductive encapsulation helps transfer heat and protect sensitive components in power conversion assemblies.
  • Inverters
  • Converters
  • Power electronics
Transformers & Electrical Components
Self-leveling silicone encapsulant protects electrical components while supporting heat dissipation.
  • Transformers
  • Electronic components
  • Electric assemblies
Processing

Mixing, Dispensing & Heat Cure

Mixing

Mix Part A and Part B at a 1:1 ratio by weight. Re-mix containers before use if filler settlement is observed after storage.

Dispensing

Suitable for automated or manual mixing and dispensing. Automated airless dispensing can reduce or avoid the need to de-air.

Curing

Typical heat cure options include 60 minutes at 60 °C or 30 minutes at 100 °C. Cure profile should be validated in the actual assembly.

Technology Advantage

How TC-6010 Supports Power Electronics Protection

Design Challenge DOWSIL™ TC-6010 Benefit
Power electronics generate heat while requiring electrical protection. Thermally conductive encapsulation helps remove heat while providing dielectric insulation.
Complex modules require material flow around components. Flowable, self-leveling behavior helps fill after dispensing.
Electronic components need mechanical and environmental protection. Elastic silicone rubber protects sensitive assemblies after cure.
Flame-rated assemblies require suitable material classification. UL 94 V-0 flammability classification supports flame-rated electronics design.
Next Steps

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Share your module type, component layout, encapsulation depth, dispensing method, cure profile, dielectric requirements, and thermal dissipation targets. We can help assess whether DOWSIL™ TC-6010 is suitable for your power electronics encapsulation application.

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