LOCTITE ECCOBOND E 1216M

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LOCTITE ECCOBOND E1216M

Main features

  • Snap Cure
  • Non anhydride curing chemistry
  • Excellent adhesion and strength

Product Description

LOCTITE ECCOBOND E 1216M is an innovative epoxy capillary flow underfill, designed for high-volume assembly operations requiring a very fast flowing underfill that fully cures in a single reflow cycle, but is stable enough to be easily shipped and used in large-volume cartridges (up to 20 oz). That's because this is a board-level underfill for underfilling larger components so it is typically dispensed in relatively larger volumes.

LOCTITE ECCOBOND E 1216M passes NASA outgassing standards and is specifically formulated to eliminate anhydride-type curing agents for those users who prefer to work with anhydride-free products.

Cure Schedule

  • Snap or Inline Cure - 3 minutes @ 165°C
  • Fast Cure - 4 minutes @ 150°C
  • Low-Temperature Cure - 10 minutes @ 130°C
Product Family

E1216M

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Product availability
US Shipping in 55 days
CA Shipping in 12 weeks
EU Shipping in 40 days
Packaging
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TDS, SDS & Technical Documents
  • LOCTITE ECCOBOND E 1216M
    English (Technical Data Sheet (TDS))
  • LOCTITE ECCOBOND E 1216M SDS
    English (Safety Data Sheet (SDS))
  • LOCTITE E 1216M 30CC EN_CH
    Dutch (Safety Data Sheet (SDS))

Technical Specifications

General Properties
Specific Gravity Specific Gravity
1.4
Work life @25°C Work life @25°C
120 hours
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
125 °C
Thermal Conductivity Thermal Conductivity
0.42 W/m.K
Electrical Properties
Volume Resistivity Volume Resistivity
28200000000000000 Ohms⋅cm
Physical Properties
Viscosity Viscosity
4,000 mPa.s

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