LOCTITE STYCAST E2517
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Main features
- Low CTE
- Low Viscosity
- High temperature resistance
Product Description
LOCTITE® STYCAST E 2517 epoxy encapsulant is formulated for use on bare chip protection in a variety of advanced packages where ease of flow and high thermal stability are required.
Recommended Cure Schedule
- Precure 1 hour @ 120°C
- Full cure 1 hour @ 150°C
- Post cure 2 hours @ 200°C
Packaging
Please select Package Type before adding your product to your cart.
TDS, SDS & Technical Documents
- STYCAST E 2517-EN
- 1293896_MSDS_UT_NL_NL
Technical Specifications
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
220 °C Thermal Conductivity Thermal Conductivity
0.5 W/m.K Chemical Properties
Water Absorption Water Absorption
0.08 % Physical Properties
Viscosity Viscosity
22,500 mPa.s Recently viewed products

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