LOCTITE STYCAST E2517

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LOCTITE STYCAST E2517

Main features

  • Low CTE
  • Low Viscosity
  • High temperature resistance

Product Description

LOCTITE® STYCAST E 2517 epoxy encapsulant is formulated for use on bare chip protection in a variety of advanced packages where ease of flow and high thermal stability are required.

Recommended Cure Schedule

  • Precure 1 hour @ 120°C
  • Full cure 1 hour @ 150°C
  • Post cure 2 hours @ 200°C
Product Family

E2517

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Product availability
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Packaging
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TDS, SDS & Technical Documents
  • STYCAST E 2517-EN
    English (Technical Data Sheet (TDS))
  • 1293896_MSDS_UT_NL_NL
    Dutch (Safety Data Sheet (SDS))

Technical Specifications

Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
220 °C
Thermal Conductivity Thermal Conductivity
0.5 W/m.K
Chemical Properties
Water Absorption Water Absorption
0.08 %
Physical Properties
Viscosity Viscosity
22,500 mPa.s

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