LOCTITE ABLESTIK E 8502-1
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- One component
- Low stress
- Thermally conductive
Product Description
LOCTITE ABLESTIK E 8502-1 is a solventless modified epoxy non-conductive adhesive known for its versatility in bonding applications. LOCTITE ABLESTIK E 8502-1 boasts a formulation that combines low-stress properties with strong adhesion capabilities across a wide array of surfaces.
LOCTITE ABLESTIK E 8502-1 flexibility makes it well-suited for scenarios involving disparate coefficients of thermal expansion (CTE), ensuring effective bonding even in mismatched CTE situations.
E8502-1
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- LOCTITE-ABLESTIK-E-8502-1-en_GL
- MSDS-LOCTITE-ABLESTIK-E-8502-1-en
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Additional Information
Curing schedule
| Temperature | Cure time |
| 120°C | 90 |
| 150°C | 60 |
| 175°C | 15 |
