ED-645CM | Two-Part Epoxy Adhesive for General Applications

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

ED-645CM | Two-part Epoxy Adhesive

Main features

  • Excellent electrical insulation
  • Reliable in humid conditions
  • High Viscosity

Product Description

LINQBOND ED-645CM is a two-component epoxy adhesive with high viscosity and thixotropic properties. These features allow it to control flow and provide sag resistance during both the working and curing processes. The cured product exhibits high toughness and excellent adhesion to different substrates such as glass, ceramics, plastics, and metals. Furthermore, LINQBOND ED-645CM offers high electrical insulation even under high humidity, grease resistance, and chemical resistance. Its hardener does not form an insoluble, whitish solid upon air exposure, and the cured surface remains free from oiliness and maintains a smooth, glossy finish

LINQBONDTM ED-645CM is an ideal solution for bonding materials in different applications. Additionally, it is RoHS 2011/65/EU compliant and meets various environmental testing requirements.

Product Key Features

  • Electrically insulating — Prevents short-cuircuiting between electrical components.
  • High viscosity and thixotropy — Provides sag resistance for working and curing processes.
  • Reliable — Resistant against humidity, grease, and chemicals, ensuring that bonded components are protected over time.

Applications

  • General assembly of components made up of different substrates, particularly those made of glass, ceramics, plastics, and metals.
Product Family

ED-645CM

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Packaging
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TDS, SDS & Technical Documents
  • TDS_LINQBOND ED-645CM
    English (Technical Data Sheet (TDS))

Technical Specifications

Thermal Properties
Degradation temperature Degradation temperature
240 °C
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
40 °C
Thermal Conductivity Thermal Conductivity
0.3 W/m.K
Thermal Impedance Thermal Impedance
1 °C·cm²/W
Weight Loss @ 300°C Weight Loss @ 300°C
3.24 %
Electrical Properties
Surface Resistivity Surface Resistivity
4.5e 15 Ohms/sq
Volume Resistivity Volume Resistivity
4.5e 15 Ohms⋅cm
Chemical Properties
Water Absorption Water Absorption
0.26 %

Additional Information

Directions for Use

  1.  Weigh the correct proportions and mix thoroughly, scraping both the bottom and the sides of the mixing container until a homogeneous mixture is obtained.
  2. Ensure that the bonding surfaces are clean, dry, and properly prepared.
  3. Use mixed product before pot life for optimum properties. Avoid large quantity mixing. Apply adhesive evenly to both surfaces for maximum bond strength.
  4. Cure time depends on part geometry, materials, bond line thickness, and oven efficiency. Confirm cure schedule with production parts and equipment.

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