ED-845CM | Fast-curing Epoxy Adhesive for Electronics Bonding
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Fast-curing
- Excellent adhesion
- High insulation, chemical resistance and anti-vibration
Product Description
LINQBOND ED-845CM is a two-component, self-leveling epoxy adhesive suitable for robust performance in electronic applications. ED-845CM has excellent toughness and achieves a full cure at ambient temperatures, providing superior resistance to aging and moisture degradation.
LINQBOND ED-845CM offers high electrical insulation even under high humidity, as well as chemical resistance and anti-vibration properties. Overall, LINQBOND ED-845CM is an ideal solution for bonding, potting and sealing materials in different applications such as electronic components, handicraft and repairing. Additionally, it is an environmentally friendly, low-carbon product that complies with UL 94 HB flame retardancy standards
Product Key Features
- Easy to use
- Fast-curing: Cures in 10 minutes at room temperature
- High insulation, chemical resistance and anti-vibration
- Solvent-free & non-corrosive
Applications
- LINQBOND ED-845CM is broadly compatible with a variety of substrates, including metals, ceramics, plastics, various rubbers, and glass. It is specifically formulated for casting, bonding, and sealing of diverse electronic components
ED-845CM/10KA
10kg Part AUnlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS_LINQBOND ED-845CM
Technical Specifications
General Properties
Thermal Properties
Mechanical Properties
Physical Properties
Additional Information
LINQBOND ED-845CM Additional Technical Specification
| Property | Value | Unit |
| Volume Ratio (A:B) | 1:1 | — |
| Operation Time @23℃ | 5 | min |
| Initial Fixation Time @23℃ | 10 - 15 | min |
| Surface Cure Time @23℃ | 10 - 30 | min |
| Through Cure Time @23℃ | 1 - 2 | day |
Directions for Use
- Weigh the correct proportions and mix thoroughly, scraping both the bottom and the sides of the mixing container until a homogeneous mixture is obtained.
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Ensure that the bonding surfaces are clean, dry, and properly prepared.
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Use mixed product before pot life for optimum properties. Avoid large quantity mixing. Apply adhesive evenly to both surfaces for maximum bond strength.
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Cure time depends on part geometry, materials, bond line thickness (recommended to be lower than 30 mm when used as potting), and oven efficiency. Confirm cure schedule with actual parts and equipment.
