LINQSOL EMC-5013 | Thermally conductive Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

Main features
- Green epoxy molding compound
- Thermally conductive molding compound
- Designed for transistor outline (TO) and fullpack power packages
Product Description
LINQSOL EMC-5013 is a thermally conductive epoxy molding compound specifically developed for the encapsulation of transistor outline (TO) such as TO220F, TO3PF and fullpack packages power packages. Its low porosity and thermal conductivity of >2 W/m·K satisfies the heat dissipation required by high performance power packages.
LINQSOL EMC-5013 has good electrical performance for packages requiring insulative property. Additionally, with a UL 94 V-0 flammability rating and low water absorption, EMC-5013 guarantees strong performance and outstanding reliability. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, LINQSOL EMC-5013 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.
Packaging
TDS, SDS & Technical Documents
- TDS_LINQSOL EMC-5013
- SDS_LINQSOL EMC-5013
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Curing Conditions
Physical Properties
Additional Information
|
Property |
Value |
Unit |
|
General Properties |
||
|
Resin type |
OCN/Low Stress |
– |
|
Filler sieving size |
180 |
µm |
|
Specific gravity |
2.17 |
– |
|
Spiral flow at 175°C |
60 |
cm |
|
Bleed Length at 175°C |
≤2.0 |
mm |
|
Chemical Properties |
||
|
Ion content Chloride (Cl–) concentration Sodium (Na+) concentration |
9 6 |
ppm |
|
Water absorption (PCT 24hr) |
0.32 |
% |
|
pH of extract |
5.5 |
– |
|
Electrical conductivity of extract |
40 |
µS⋅cm–1 |
|
Electrical Properties |
||
|
Dielectric constant at 1MHz |
4.2 |
- |
|
Dissipation factor at 1MHz |
0.009 |
- |
|
Volume resistivity at 25°C |
7×1015 |
Ω⋅cm |
Processing Instructions
-
Before use, let LINQSOL EMC-5013 compounds reach room temperature for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
-
Use the materials within 72 hours after removing the container from cold storage.
Storage and Handling
LINQSOL EMC-5013 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5 °C is 183 days.
Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.