LINQSOL EMC-5013 | Thermally conductive Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LINQSOL EMC-5013 | Thermally conductive Epoxy Mold Compound

Main features

  • Green epoxy molding compound
  • Thermally conductive molding compound
  • Designed for transistor outline (TO) and fullpack power packages

Product Description

LINQSOL EMC-5013 is a thermally conductive epoxy molding compound specifically developed for the encapsulation of transistor outline (TO) such as TO220F, TO3PF and fullpack packages power packages. Its low porosity and thermal conductivity of >2 W/m·K satisfies the heat dissipation required  by high performance power packages. 

LINQSOL EMC-5013 has good electrical performance for packages requiring insulative property. Additionally, with a UL 94 V-0 flammability rating and low water absorption, EMC-5013 guarantees strong performance and outstanding reliability. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, LINQSOL EMC-5013 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

 

Product Family

EMC-5013

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Catalog Product

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Packaging
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TDS, SDS & Technical Documents
  • TDS_LINQSOL EMC-5013
    English (Technical Data Sheet (TDS))
  • SDS_LINQSOL EMC-5013
    English (Safety Data Sheet (SDS))

Technical Specifications

General Properties
Color Color
Black
Specific Gravity Specific Gravity
2.17
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
178 °C
Thermal Conductivity Thermal Conductivity
2.3 W/m.K
UL 94 Rating UL 94 Rating
V-0
Electrical Properties
Volume Resistivity Volume Resistivity
7E15 Ohms⋅cm
Chemical Properties
Moisture absorption Moisture absorption
0.32 %
Curing Conditions
Transfer Pressure Transfer Pressure
40-90 kg/cm2
Transfer Time Transfer Time
17-25 s
Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
60 cm

Additional Information

 

Property

Value

Unit

General Properties

Resin type

OCN/Low Stress

Filler sieving size

180

µm

Specific gravity

2.17

Spiral flow at 175°C

60

cm

Bleed Length at 175°C

≤2.0

mm

Chemical Properties

Ion content

Chloride (Cl) concentration

Sodium (Na+) concentration


9

6


ppm

ppm

Water absorption (PCT 24hr)

0.32

%

pH of extract

5.5

Electrical conductivity of extract

40

µS⋅cm–1

Electrical Properties

Dielectric constant at 1MHz

4.2

-

Dissipation factor at 1MHz

0.009

-

Volume resistivity at 25°C

7×1015

Ωcm

Processing Instructions

  • Before use, let LINQSOL EMC-5013 compounds reach room temperature for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination. 

  • Use the materials within 72 hours after removing the container from cold storage.

 

Storage and Handling

LINQSOL EMC-5013 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5 °C is 183 days. 

Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.

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